Patents by Inventor David William Sissenstein, Jr.

David William Sissenstein, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110139364
    Abstract: A method and assembly for chemically modifying chromate converted aluminum work pieces to improve adhesion. The chromate converted aluminum work pieces are treated with oxygen plasma within the range of 500 W to 1500 W for approximately 5 to 30 minutes to chemically modify the free cyanide in the chromate coating. The free cyanide is modified into functional groups that chemically bond with silicone based adhesives. Adhesion strength of at least 100% improvement is observed. An aluminum heat sink is attached to modules with a silicone based elastomer containing a thermally enhanced additive. The thermally enhanced adhesive is dispensed onto application specific integrated circuit (ASIC) chips, memory chips, or laminates of the modules. Subsequently, the assembled device is cured at 150° C. for approximately one hour.
    Type: Application
    Filed: December 16, 2009
    Publication date: June 16, 2011
    Inventors: Luis J. Matienzo, David William Sissenstein, JR.
  • Patent number: 5900351
    Abstract: It has been discovered that organic photoresists may be quickly, coveniently, and completely stripped using a hot hydrogen atmosphere. The substrates are preferably exposed to such atmosphere utilizing a hydrogen conveyor furnace. The gases from the furnace are burned to carbon dioxide and water thereby eliminating the need to dispose of a stripping agent.
    Type: Grant
    Filed: June 3, 1997
    Date of Patent: May 4, 1999
    Assignee: International Business Machines Corporation
    Inventors: Rebecca Christine Lutsic, James Richard Murray, David William Sissenstein, Jr.
  • Patent number: 5691117
    Abstract: It has been discovered that organic photoresists may be quickly, conveniently, and completely stripped using a hot hydrogen atmosphere. The substrates are preferably exposed to such atmosphere utilizing a hydrogen conveyor furnace. The gases from the furnace are burned to carbon dioxide and water thereby eliminating the need to dispose of a stripping agent.
    Type: Grant
    Filed: January 17, 1995
    Date of Patent: November 25, 1997
    Assignee: International Business Machines Corporation
    Inventors: Rebecca Christine Lutsic, James Richard Murray, David William Sissenstein, Jr.