Patents by Inventor David Woodham

David Woodham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9887104
    Abstract: Some embodiments relate to an electronic package. The electronic package includes a substrate and a die attached to the substrate. The electronic package further includes an underfill positioned between the die and the substrate due to capillary action. A support surrounds the die. The support provides the same beneficial fillet geometry on all die edges. Therefore, the support provides similar stress reduction on all die edges. Other embodiments relate to method of fabricating an electronic package. The method includes attaching a die to a substrate and inserting an underfill between the die and the substrate using capillary action. The method further includes placing a support around the die such that the support surrounds the die.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: February 6, 2018
    Assignee: Intel Corporation
    Inventors: Manish Dubey, Rajendra C. Dias, Patrick Nardi, David Woodhams
  • Publication number: 20160005672
    Abstract: Some embodiments relate to an electronic package. The electronic package includes a substrate and a die attached to the substrate. The electronic package further includes an underfill positioned between the die and the substrate due to capillary action. A support surrounds the die. The support provides the same beneficial fillet geometry on all die edges. Therefore, the support provides similar stress reduction on all die edges. Other embodiments relate to method of fabricating an electronic package. The method includes attaching a die to a substrate and inserting an underfill between the die and the substrate using capillary action. The method further includes placing a support around the die such that the support surrounds the die.
    Type: Application
    Filed: July 3, 2014
    Publication date: January 7, 2016
    Inventors: Manish Dubey, Rajendra C. Dias, Patrick Nardi, David Woodhams
  • Publication number: 20050182851
    Abstract: A method and system for recovering a server blade, in a multiple server blade computer, that is lost during a flash update operation on a service processor in the server blade. Because of the flash update failure, the lost server blade is unaware of its location on a management pathway, which in an exemplary form may be a midplane or a bus, which connects the server blade and a management module in a server blade chassis. The lost server blade puts a signal on the management pathway indicating that the flash failed. The signal is put on a special channel reserved for such messages. The management module receives the signal, and then determines which of the multiple server blades are lost due to the flash update failure.
    Type: Application
    Filed: February 12, 2004
    Publication date: August 18, 2005
    Applicant: International Business Machines Corp.
    Inventors: Gerhard Buckler, Jeffery Franke, Donald Johnson, Carl Morrell, David Woodham