Abstract: The present disclosure is directed to characterizing the adhesion between thin films and rigid substrates. Exemplary embodiments provide systems, apparatus and methods to characterize mechanical mix-mode adhesion between thin films and rigid substrates using the blister test (BT). Exemplary embodiments provide the full triaxial displacement field obtained through Digital Image Correlation with inverse Finite Element Method simulations using Cohesive Zone Elements. Particular embodiments eliminate the need for making mechanistic or kinematic assumptions of the blister formation and allow the characterization of the full traction-separation law governing the adhesion between the film and the substrate. Exemplary embodiments can aid in the design and optimization of adhesively bonded structures by providing a comprehensive understanding of the adhesion mechanics between thin films and rigid substrates.