Abstract: In general, the present invention is directed to a continuous method of making a polymer foam by using a polymer having a first monomeric component and a second monomeric component. The method employs a tandem type extruder having a first extruder and a second extruder. The method disclosed herein can provide a foam having a desired cell size, cell density, porosity, foam density, and/or thermal conductivity, etc. In turn, the polymer foams produced according to the present method can have numerous applications, such as thermal insulation applications for appliances including ovens, freezers, refrigerators, etc.

Abstract: A composition for destructive interference in at least a portion of the frequency range from about 1 GHz to about 20 GHz can comprise a dielectric and a conductive filler mixed with at least a portion of the dielectric, wherein the percentage volume of the conductive filler relative to the total volume of the composition is configured such that the wavelength of sensitivity for the composition is on the order of a wavelength of an incident electromagnetic radiation in at least a portion of the frequency range from about 1 GHz to about 20 GHz.

Abstract: A composition for energy dissipation in at least a portion of the frequency range from about 1 GHz to about 20 GHz, the composition can comprise a dielectric and graphene mixed with at least a portion of the dielectric, wherein the percentage volume of the graphene relative to the total volume of the composition is configured such that dissipation of incident electromagnetic radiation is substantially optimized in at least a portion of the frequency range from about 1 GHz to about 20 GHz.

Abstract: A method for forming a composition exhibiting energy dissipation in at least a portion of the frequency range from about 1 GHz to about 20 GHz can comprise treating a magnetic lossy material to increase the brittleness of the material, processing at least a portion of the magnetic lossy material into a powder, and mixing at least a portion of the powder with a dielectric resin, wherein the percentage volume of the powder relative to the total volume of the composition is configured such that dissipation of incident electromagnetic radiation is substantially optimized in at least a portion of the frequency range from about 1 GHz to about 20 GHz.

Abstract: A composition for destructive interference in at least a portion of the frequency range from about 1 GHz to about 20 GHz can comprise a dielectric and a conductive filler mixed with at least a portion of the dielectric, wherein the percentage volume of the conductive filler relative to the total volume of the composition is configured such that the wavelength of sensitivity for the composition is on the order of a wavelength of an incident electromagnetic radiation in at least a portion of the frequency range from about 1 GHz to about 20 GHz.

Abstract: A composition for energy dissipation in at least a portion of the frequency range from about 1 GHz to about 20 GHz, the composition can comprise a dielectric and graphene mixed with at least a portion of the dielectric, wherein the percentage volume of the graphene relative to the total volume of the composition is configured such that dissipation of incident electromagnetic radiation is substantially optimized in at least a portion of the frequency range from about 1 GHz to about 20 GHz.

Abstract: A composition includes a metal precursor. The metal precursor may include an inorganic ligand and a metal cation. The inorganic ligand may include a carbamate group. An associated method is provided.

Abstract: A composition includes a metal precursor. The metal precursor may include an inorganic ligand and a metal cation. The inorganic ligand may include a carbamate group. An associated method is provided.

Abstract: Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles.

Abstract: A composition includes a polymer precursor and a metal precursor. The metal precursor may include a carbamate and a metal cation. The metal precursor may be responsive to an application of energy to form a metal nanoparticle. An associated method is provided.

Abstract: A composition includes a decomposition product of a metal precursor. The metal precursor may include a carbamate, and a metal cation. The decomposition product may include a metal nanoparticle. An associated method is provided.

Abstract: A composition includes a decomposition product of a metal precursor. The metal precursor may include a carbamate and one or more metal selected from the group consisting of silver, gold, copper, and zinc. The decomposition product may include a metal nanoparticle. The metal nanoparticle may be present in an amount that is sufficient to render the composition electrically conductive, thermally conductive, or both electrically and thermally conductive. An associated article and method are provided.

Abstract: A nanostructure having at least one nanotube and at least one chemical moiety non-covalently attached to the at least one nanotube. At least one dendrimer is bonded to the chemical moiety. The chemical moiety may include soluble polymers, soluble oligomers, and combinations thereof. A method of dispersing at least one nanotube is also described. The method includes providing at least one nanotube and at least one chemical moiety to a solvent; debundling the nanotube; and non-covalently attaching a chemical moiety to the nanotube, wherein the non-covalently attached chemical moiety disperses the nanotube. A method of separating at least one semi-conducting carbon nanotube is also described.