Patents by Inventor Davis Hoang Nhan

Davis Hoang Nhan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Absorbent composite having selective regions for improved attachment
    Publication number: 20060069365
    Abstract: An absorbent composite has at least one first region and at least one second region. The first region includes an elastomeric polymer at a first concentration and at least one absorbent material, such as superabsorbent material, and the second region includes an elastomeric polymer at a second concentration. The absorbent composite can provide improved attachment within an absorbent article, such as a stretchable absorbent article, even after fluid loading, while maintaining suitable absorbent properties.
    Type: Application
    Filed: September 30, 2004
    Publication date: March 30, 2006
    Inventors: Michael Sperl, Davis Hoang Nhan, Gabriel Adam, David Jackson, Barry Fitzsimons, Hoa Wilhelm
  • Method and apparatus for reducing adhesive build-up on ultrasonic bonding surfaces
    Patent number: 6662992
    Abstract: A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such that the fluid is applied is intermittently or continuously applied to at least a portion of the ultrasonic bonding surface.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: December 16, 2003
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Chinmay Suresh Betrabet, Davis Hoang Nhan, Barton Andrew Laughlin, Daniel Hoo, James Melvin Gaestel
  • Method and apparatus for reducing adhesive build-up on ultrasonic bonding surfaces
    Publication number: 20020121292
    Abstract: A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such that the fluid is applied is intermittently or continuously applied to at least a portion of the ultrasonic bonding surface.
    Type: Application
    Filed: December 19, 2001
    Publication date: September 5, 2002
    Applicant: Kimberly-Clark Worldwide, Inc.
    Inventors: Chinmay Suresh Betrabet, Davis Hoang Nhan, Barton Andrew Laughlin, Daniel Hoo, James Melvin Gaestel