Abstract: A gas diffusion layer for an electrolyser or for a fuel cell comprises a first nonwoven layer of metal fibers provided for contacting a proton exchange membrane, a second nonwoven layer of metal fibers, and a third porous metal layer. The first nonwoven layer of metal fibers comprises metal fibers of a first equivalent diameter. The second nonwoven layer of metal fibers comprises metal fibers of a second equivalent diameter. The second equivalent diameter is larger than the first equivalent diameter. The third porous metal layer comprises open pores. The open pores of the third porous metal layer are larger than the open pores of the second nonwoven layer of metal fibers. The second nonwoven layer is provided in between and contacting the first nonwoven layer and the third porous metal layer. The second nonwoven layer is metallurgically bonded to the first nonwoven layer and to the third porous metal layer.

Abstract: Carrier onto which a wafer can be temporarily bonded. The carrier comprises a plate shaped laminate. The plate shaped laminate comprises a first layer. The first layer comprises a metal foil or a metal sheet. The plate shaped laminate comprises a second layer comprising a porous metal medium with three-dimensional open pores. The porous metal medium comprises metal fibers. The first layer is permanently bonded to the porous metal medium thereby closing the pores of the porous metal medium at the side where the first layer is located.

Abstract: A fixed abrasive sawing wire is presented that comprises a core (310) and an outer sheath layer (320) that is softer than the core. In the sheath abrasive particles are embedded that are held by a binding layer. The bond between core and sheath is enhanced by making it rough. The arithmetical mean deviating roughness must at least be higher than 0.50 micron. Particularly preferred is when interlocking between the core and the sheath is introduced. Such interface roughness can be obtained by subjecting the wire to sufficient cold forming by wire drawing. Interlocking will occur at even higher degrees of cold forming. The binding layer can be a metallic binding layer or an organic binding layer.