Patents by Inventor Daw Don CHEAM

Daw Don CHEAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through silicon interposer wafer and method of manufacturing the same
    Patent number: 10882737
    Abstract: A through silicon interposer wafer and method of manufacturing the same. A through silicon interposer wafer having at least one cavity formed therein for MEMS applications and a method of manufacturing the same are provided. The through silicon interposer wafer includes one or more filled silicon vias formed sufficiently proximate to the at least one cavity to provide support for walls of the at least one cavity during subsequent processing of the interposer wafer.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: January 5, 2021
    Assignee: Agency for Science, Technology and Research
    Inventors: Navab Singh, Daw Don Cheam
  • A THROUGH SILICON INTERPOSER WAFER AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190084826
    Abstract: A Through Silicon Interposer Wafer and Method of Manufacturing the Same A through silicon interposer wafer having at least one cavity formed therein for MEMS applications and a method of manufacturing the same are provided. The through silicon interposer wafer includes one or more filled silicon vias formed sufficiently proximate to the at least one cavity to provide support for walls of the at least one cavity during subsequent processing of the interposer wafer.
    Type: Application
    Filed: March 23, 2017
    Publication date: March 21, 2019
    Inventors: Navab SINGH, Daw Don CHEAM