Patents by Inventor Dawei NIE

Dawei NIE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230420608
    Abstract: The present disclosure includes an all-nitride-based epitaxial and chip structure and a light-emitting device. The epitaxial and chip structure includes an N-type semiconductor layer, a P-type semiconductor layer, an electroluminescent (EL) multiple quantum wells (MQWs) region, and a first photoluminescent (PL) multiple quantum wells (MQWs) region stacked on a main surface of a substrate. The EL MQWs region generates a first-color light by an EL method and the first-color light is further transmitted to the first PL MQWs region or/and the second PL MQWs region where the second-color light or/and the third-color light are generated by a PL method. The present disclosure provides an EL MQWs region to generate the first-color light, and also provides a first, a second or more PL MQWs regions to further convert the first-color light into the second, the third or more-color lights which allow RGB or multiple colors emission.
    Type: Application
    Filed: August 22, 2023
    Publication date: December 28, 2023
    Inventors: David YOUNG, Yanhao DU, Wei SUN, Anli YANG, Dawei NIE, Jingting HE, Zengliang ZHONG
  • Publication number: 20230295849
    Abstract: A needling device includes: a needling assembly, a support, a base and a bearing frame. The base is provided inside the bearing frame, and the base is for bearing the preform body. The support is provided with a guide rail. The needling assembly is slidably connected to the support, and may slide along the guide rail, to needle the preform body. The needling assembly may perform an all-around needling operation to the circular-arc surface of the preform body, and depth and density of the needling by the needling assembly to the circular-arc surface of the preform body are even, which may prevent deformation and layering of the preform body during the deposition, to improve the processing quality of the preform body.
    Type: Application
    Filed: December 4, 2020
    Publication date: September 21, 2023
    Inventors: Shuzhen DENG, Linkui YANG, Aijun LIU, Xinjun CHEN, Xinlin HU, Dawei NIE, Guoliang WANG, Dehua YANG