Abstract: A sandwich panel for an automobile includes a core layer, a surface layer, and an adhesive layer. The core layer includes glass fibers and thermoplastic resins and defines an optimal weight and thickness to provide flexural performance and non-flammability. The sandwich panel provides a flame barrier layer, which is a non-combustible layer during ignition and prevents flame from leaking to the outside of the panel.

Abstract: The present disclosure provides a seat cushion extension device for a fold-and-dive seat. The seat cushion extension device may include a pair of seat cushion side frames arranged at a predetermined interval, a seatback frame rotatably connected to the pair of seat cushion side frames and having a guide pin formed on an outer surface thereof, a seat cushion frame, a pair of links rotatably connected between the pair of seat cushion side frames and a front end of the seat cushion frame, and a pair of extension frames. Each of the pair of extension frames may have a front end connected to the seat cushion frame, and a rear end formed with a guide hole, into which a guide pin may be inserted. The seat cushion extension device may facilitate a forward extension of a seat cushion regardless of a position of a seatback of the fold-and-dive seat.

Abstract: An embodiment of the present disclosure provides a display device including a substrate, a thin film transistor on the substrate, a first electrode electrically connected to the thin film transistor, a light emitting layer and a second electrode overlapping the first electrode, a first partition wall between the first electrode and the second electrode, and a second partition wall overlapping the first partition wall, wherein the first partition wall includes at least one of a black pigment and a black dye, wherein the second partition wall includes an organic insulating material, and wherein a portion of the second partition wall overlaps the first electrode.

Abstract: An embodiment of the present disclosure provides a display device including a substrate, a thin film transistor on the substrate, a first electrode electrically connected to the thin film transistor, a light emitting layer and a second electrode overlapping the first electrode, a first partition wall between the first electrode and the second electrode, and a second partition wall overlapping the first partition wall, wherein the first partition wall includes at least one of a black pigment and a black dye, wherein the second partition wall includes an organic insulating material, and wherein a portion of the second partition wall overlaps the first electrode.

Abstract: An embodiment of the present disclosure provides a display device including a substrate, a thin film transistor on the substrate, a first electrode electrically connected to the thin film transistor, a light emitting layer and a second electrode overlapping the first electrode, a first partition wall between the first electrode and the second electrode, and a second partition wall overlapping the first partition wall, wherein the first partition wall includes at least one of a black pigment and a black dye, wherein the second partition wall includes an organic insulating material, and wherein a portion of the second partition wall overlaps the first electrode.

Abstract: An organic light emitting display device may include a base substrate including an emission area at which light is emitted and a peripheral area which is adjacent to the emission area; an encapsulation substrate disposed on the base substrate; a common layer between the base substrate and the encapsulation substrate, the common layer disposed in both the emission area and the peripheral area; between the base substrate and the common layer, each of: a planarization layer; a pixel electrode in the emission area; and a pixel defining layer; and a discharging hole disposed corresponding to the pixel defining layer, the discharging hole extending through the common layer.

Abstract: An embodiment of the present disclosure provides a display device including a substrate, a thin film transistor on the substrate, a first electrode electrically connected to the thin film transistor, a light emitting layer and a second electrode overlapping the first electrode, a first partition wall between the first electrode and the second electrode, and a second partition wall overlapping the first partition wall, wherein the first partition wall includes at least one of a black pigment and a black dye, wherein the second partition wall includes an organic insulating material, and wherein a portion of the second partition wall overlaps the first electrode.

Abstract: An organic light emitting display device may include a base substrate including an emission area at which light is emitted and a peripheral area which is adjacent to the emission area; an encapsulation substrate disposed on the base substrate; a common layer between the base substrate and the encapsulation substrate, the common layer disposed in both the emission area and the peripheral area; between the base substrate and the common layer, each of: a planarization layer; a pixel electrode in the emission area; and a pixel defining layer; and a discharging hole disposed corresponding to the pixel defining layer, the discharging hole extending through the common layer.

Abstract: A method divides a wafer into at least one chip. The chip includes internal metallic features. The dividing deposits at least one metallic substance on the outer surface of the chip. After so dividing the chip, the process exposes the chip to a heated ambient environment having a given pressure (e.g., less than one atmosphere). The environment comprises a chemical agent capable of bonding with the metallic substance. Additionally, wet chemical etch can be performed on the chip.

Abstract: A method divides a wafer into at least one chip. The chip includes internal metallic features. The dividing deposits at least one metallic substance on the outer surface of the chip. After so dividing the chip, the process exposes the chip to a heated ambient environment having a given pressure (e.g., less than one atmosphere). The environment comprises a chemical agent capable of bonding with the metallic substance. Additionally, wet chemical etch can be performed on the chip.