Patents by Inventor De-Shuo Chen

De-Shuo Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating light emitting diode (LED) dice with wavelength conversion layers
    Patent number: 9312455
    Abstract: A method for fabricating light emitting diode (LED) dice includes the step of providing a wavelength conversion layer on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy, such as electromagnetic radiation or heat. The method also includes the step of exposing the adhesive layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer, removing the wavelength conversion layer from the substrate, and attaching the wavelength conversion layer to the light emitting diode (LED) die.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: April 12, 2016
    Assignee: SemiLEDS Optoelectronics Co., Ltd.
    Inventors: Jui-Kang Yen, De-Shuo Chen
  • METHOD FOR FABRICATING LIGHT EMITTING DIODE (LED) DICE WITH WAVELENGTH CONVERSION LAYERS
    Publication number: 20150072455
    Abstract: A method for fabricating light emitting diode (LED) dice includes the step of providing a wavelength conversion layer on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy, such as electromagnetic radiation or heat. The method also includes the step of exposing the adhesive layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer, removing the wavelength conversion layer from the substrate, and attaching the wavelength conversion layer to the light emitting diode (LED) die.
    Type: Application
    Filed: November 14, 2014
    Publication date: March 12, 2015
    Applicant: SEMILEDS OPTOELECTRONICS CO., LTD.
    Inventors: JUI-KANG YEN, De-Shuo Chen
  • System and method for fabricating light emitting diode (LED) dice with wavelength conversion layers
    Patent number: 8912021
    Abstract: A system for fabricating light emitting diode (LED) dice includes a wavelength conversion layer contained on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy, such as electromagnetic radiation or heat. The system also includes a curing apparatus configured to reduce the adhesiveness of the adhesive layer to facilitate removal of the wavelength conversion layer from the substrate, and an attachment apparatus configured to remove the wavelength conversion layer from the substrate and to attach the wavelength conversion layer to a light emitting diode (LED) die. A method for fabricating light emitting diode (LED) dice includes the steps of exposing the adhesive layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer, removing the wavelength conversion layer from the substrate, and attaching the wavelength conversion layer to the light emitting diode (LED) die.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: December 16, 2014
    Assignee: SemiLEDS Optoelectronics Co., Ltd.
    Inventors: Jui-Kang Yen, De-Shuo Chen
  • SYSTEM AND METHOD FOR FABRICATING LIGHT EMITTING DIODE (LED) DICE WITH WAVELENTH CONVERSION LAYERS
    Publication number: 20130062646
    Abstract: A system for fabricating light emitting diode (LED) dice includes a wavelength conversion layer contained on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy, such as electromagnetic radiation or heat. The system also includes a curing apparatus configured to reduce the adhesiveness of the adhesive layer to facilitate removal of the wavelength conversion layer from the substrate, and an attachment apparatus configured to remove the wavelength conversion layer from the substrate and to attach the wavelength conversion layer to a light emitting diode (LED) die. A method for fabricating light emitting diode (LED) dice includes the steps of exposing the adhesive layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer, removing the wavelength conversion layer from the substrate, and attaching the wavelength conversion layer to the light emitting diode (LED) die.
    Type: Application
    Filed: May 17, 2012
    Publication date: March 14, 2013
    Applicant: SemiLEDS OPTOELECTRONICS CO., LTD.
    Inventors: JUI-KANG YEN, De-Shuo Chen