Patents by Inventor De Zhong HAN

De Zhong HAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10813244
    Abstract: An electronic device includes a waterproof case, including a closed space, and a flow guide assembly, an electronic module and a cover, provided in the closed space. The cover includes a cover top plate and a cover side plate which, together with a case bottom plate and a case side plate, form an accommodation space for accommodating the flow guide assembly and the electronic module. Further, the cover includes a first vent hole and a second vent hole. The flow guide assembly is configured to guide air, entering the accommodation space from the first vent hole, to flow through the electronic module and to be discharged from the second vent hole. The flow guide assembly is further configured to guide air, entering the cavity from the first vent hole, to flow through the electronic module and to be discharged from the second vent hole.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: October 20, 2020
    Assignee: SIEMENS LTD., CHINA
    Inventors: Hai Liu, Xue Feng Zhu, De Zhong Han, Hai Bo Sheng, Xi Tao
  • Publication number: 20190104629
    Abstract: An electronic device includes a waterproof case, including a closed space, and a flow guide assembly, an electronic module and a cover, provided in the closed space. The cover includes a cover top plate and a cover side plate which, together with a case bottom plate and a case side plate, form an accommodation space for accommodating the flow guide assembly and the electronic module. Further, the cover includes a first vent hole and a second vent hole. The flow guide assembly is configured to guide air, entering the accommodation space from the first vent hole, to flow through the electronic module and to be discharged from the second vent hole. The flow guide assembly is further configured to guide air, entering the cavity from the first vent hole, to flow through the electronic module and to be discharged from the second vent hole.
    Type: Application
    Filed: September 19, 2018
    Publication date: April 4, 2019
    Applicant: Siemens Ltd., China
    Inventors: Hai LIU, Xue Feng ZHU, De Zhong HAN, Hai Bo SHENG, Xi TAO