Patents by Inventor Dea-Yun Kim

Dea-Yun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of and apparatus for controlling the chemical mechanical polishing of multiple layers on a substrate
    Patent number: 6827629
    Abstract: A polishing system controls the durations over which different layers on a substrate are sequentially polished. The polishing system polishes an upper layer using an endpoint detection technique and polishes a lower layer using a closed loop control technique. Once the lower layer is detected during the course of polishing the upper layer, the polishing system automatically enters the recipe for polishing the lower layer under a closed loop control mode.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: December 7, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dea-Yun Kim, Jae-Won Hwang, Eun-Ju Kang
  • Method of and apparatus for controlling the chemical mechanical polishing of multiple layers on a substrate
    Publication number: 20040111175
    Abstract: A polishing system controls the durations over which different layers on a substrate are sequentially polished. The polishing system polishes an upper layer using an endpoint detection technique and polishes a lower layer using a closed loop control technique. Once the lower layer is detected during the course of polishing the upper layer, the polishing system automatically enters the recipe for polishing the lower layer under a closed loop control mode.
    Type: Application
    Filed: December 4, 2003
    Publication date: June 10, 2004
    Inventors: Dea-Yun Kim, Jae-Won Hwang, Eun-Ju Kang