Patents by Inventor Dean Anthony Bugg

Dean Anthony Bugg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7507778
    Abstract: A composition comprising (A) an epoxide containing at least two epoxy groups per molecule, (B) a polyol containing at least two hydroxy groups per molecule or a primary or secondary amine containing at least two amino-hydrogen atoms per molecule, and (C) a solid compound containing at least two isocyanate groups, exhibits high storage stability and is useful as protective coating or adhesive.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: March 24, 2009
    Assignee: Huntsman Advanced Materials Americas Inc.
    Inventors: Sim Chow, Dean Anthony Bugg
  • Patent number: 7141629
    Abstract: A composition comprising (A) an epoxide containing at least two epoxy groups per molecule, (B) a polyol containing at least two hydroxy groups per molecule or a primary or secondary amine containing at least two amino-hydrogen atoms per molecule, and (C) a solid compound containing at least two isocyanate groups, exhibits high storage stability and is useful as protective coating or adhesive.
    Type: Grant
    Filed: January 23, 2001
    Date of Patent: November 28, 2006
    Assignee: Huntsman Advanced Materials Americas Inc.
    Inventors: Sim Chow, Dean Anthony Bugg
  • Patent number: 6635202
    Abstract: The present invention relates to a process for the fast and efficient filling of voids of both simple and complex shape which can be carried out at room temperature. In particular, the present invention consists of the use of free flowing thermally expanding and curing powders which are poured into the voids and then heated causing the powder to expand, coalesce and cure and thus filling or partially filling the void space as required. The process according to the present invention is particularly suitable for filling the spaces in, around and between honeycomb or pre-formed foam cores as required to produce a filled or partially filled honeycomb or foam core or any other material used in sandwich panel construction. This process is also a simple and efficient method for filling moulds suitable for use in cellular artefact production. The filled or partially filled mould or honeycomb core can then be cured to produce bonded sandwich panels or moulded cellular artefacts.
    Type: Grant
    Filed: October 15, 1999
    Date of Patent: October 21, 2003
    Assignee: Vantico Inc.
    Inventors: Dean Anthony Bugg, Barrie James Hayes
  • Publication number: 20030149194
    Abstract: A composition comprising (A) an epoxide containing at least two epoxy groups per molecule, (B) a polyol containing at least two hydroxy groups per molecule or a primary or secondary amine containing at least two amino-hydrogen atoms per molecule, and (C) a solid compound containing at least two isocyanate groups, exhibits high storage stability and is useful as protective coating or adhesive.
    Type: Application
    Filed: January 21, 2003
    Publication date: August 7, 2003
    Inventors: Sim Chow, Dean Anthony Bugg