Abstract: In a method for manufacturing a high-brightness planar lamp, a reflecting plate is first provided, and several UV light sources are placed on the reflecting plate. Next, liquid macromolecular polymer is uniformly coated on the reflecting plate and the UV light sources, and fluorescent powder is then uniformly coated on the macromolecular polymer. In another method for manufacturing a high brightness planar lamp, a reflecting plate is first provided, and several UV light sources are placed on the reflecting plate. Next, fluorescent powder and liquid macromolecular polymer are mixed up and uniformly coated on the reflecting plate and the UV light sources. A solidification procedure is then performed. The solidification ways of the mixture of fluorescent powder and macromolecular polymer includes solidification by heating and solidification by illumination of UV light.

Abstract: A high-brightness flat lamp structure comprises a reflecting plate, a plurality of UV light sources, a macromolecular polymer layer and a fluorescent powder layer. The UV light sources and the macromolecular polymer layer are sandwiched between the reflecting plate and the fluorescent powder layer. The functions of diffusing and guiding light of the macromolecular polymer layer are exploited to let UV lights emitted by the UV light sources and reflected by the reflecting plate excite the fluorescent powder layer to radiate high-brightness visible lights. Besides, macromolecular polymer and fluorescent powder can be mixed up to form a mixed layer of macromolecular polymer and fluorescent powder to let UV lights emitted by the UV light sources and reflected by the reflecting plate directly excite fluorescent powder to radiate high-brightness visible lights.

Abstract: In a method for manufacturing a high-brightness planar lamp, a reflecting plate is first provided, and several UV light sources are placed on the reflecting plate. Next, liquid macromolecular polymer is uniformly coated on the reflecting plate and the UV light sources, and fluorescent powder is then uniformly coated on the macromolecular polymer. In another method for manufacturing a high brightness planar lamp, a reflecting plate is first provided, and several UV light sources are placed on the reflecting plate. Next, fluorescent powder and liquid macromolecular polymer are mixed up and uniformly coated on the reflecting plate and the UV light sources. A solidification procedure is then performed. The solidification ways of the mixture of fluorescent powder and macromolecular polymer includes solidification by heating and solidification by illumination of UV light.

Abstract: A high-brightness flat lamp structure comprises a reflecting plate, a plurality of UV light sources, a macromolecular polymer layer and a fluorescent powder layer. The UV light sources and the macromolecular polymer layer are sandwiched between the reflecting plate and the fluorescent powder layer. The functions of diffusing and guiding light of the macromolecular polymer layer are exploited to let UV lights emitted by the UV light sources and reflected by the reflecting plate excite the fluorescent powder layer to radiate high-brightness visible lights. Besides, macromolecular polymer and fluorescent powder can be mixed up to form a mixed layer of macromolecular polymer and fluorescent powder to let UV lights emitted by the UV light sources and reflected by the reflecting plate directly excite fluorescent powder to radiate high-brightness visible lights.

Abstract: A process for manufacturing a phosphorescent screen for use in a cathode ray or field emission display, is described. The phosphor layer is applied in the form of a slurry consisting of a powdered phosphor, an ethylene glycol monobutyl ether acetate solvent, and a cellulose acetate butyrate binder. The phosphor concentration is between 30 and 60% by weight, the solvent between 5 and 52.5% and the binder between 17.5 and 35%. If the slurry composition falls within these ranges, then, once the aluminum anode layer is in place, all organic material can be removed by firing at a temperature that is less than 500.degree. C. By keeping the firing temperature below 500.degree. C., roughening of the undersurface of the aluminum is avoided and a more efficient screen is obtained. Data to illustrate this is also provided.

Abstract: A formulation of solid powder, a solvent system, a binder material, and a plasticizing agent is described whose accomplishment is achieved by means of a step-by-step process. The pastes so formulated can be employed in a screen printing process to produce surface layer patterns with various specific physical properties such as phosphorescence, electrical conductivity, mechanical adhesion, and dielectric properties as desired.

Abstract: Two embodiments of a method for metallizing a phosphor layer are presented. The key to the method is covering the phosphor with a temporary planarizing layer onto which the metallizing layer (typically aluminum) is then deposited. Once the metal layer is in place, the planarizing layer is removed (by a burning process), the metal then making good contact with the phosphor and the substrate. In the first embodiment, the dry film is located below the phosphor layer while in the second embodiment it is located above it.

Abstract: A formulation of solid powder, a solvent system, a binder material, and a plasticizing agent is described whose accomplishment is achieved by means of a step-by-step process. The pastes so formulated can be employed in a screen printing process to produce surface layer patterns with various specific physical properties such as phosphorescence, electrical conductivity, mechanical adhesion, and dielectric properties as desired.

Abstract: An improved method of screen printing is described wherein a double sided tape (dry film) is applied between the substrate and the screened-on paste. Since the dry film ensures the adhesion of the paste, no minimum thickness of paste is needed to attain good adhesion. By applying a thin layer of paste multiple times any thickness over a wide range can be obtained. Once the desired thickness of paste has been applied, the dry film is removed by firing in an oxidizing atmosphere. The method is applicable to, among others, phosphors, resistive materials, and conductive materials.