Patents by Inventor Dean Eifert

Dean Eifert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140284233
    Abstract: A part packaging system and method includes a package blank formed as a single sheet of foldable material having fold lines disposed thereon and cutout portions defined therein for enabling the package blank to be folded into a configuration of an enclosed package. The system further includes a jig configured to complementarily receive the package blank and facilitate folding of the package blank into the enclosed package. The jig includes contact portions that correspond to the fold lines of the package blank such that pressure applied to the package blank when received in the jig causes the package blank to fold along the fold lines toward the configuration of the enclosed package.
    Type: Application
    Filed: March 25, 2014
    Publication date: September 25, 2014
    Applicant: Honda Motor Co., Ltd.
    Inventors: Michael Van Patten, Christopher Braun, Dean Eifert