Patents by Inventor Dean Eric Sequera

Dean Eric Sequera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of imaging reagent beads, analyzing, and redistributing intensity
    Patent number: 9128860
    Abstract: A method of analyzing reagent beads retained in a sample well of a sample plate is disclosed comprising obtaining an image of a reagent bead, distributing intensity values of image pixels amongst a plurality of intensity bins and generating an histogram. A curve is fitted to the histogram and the curve is compared with an idealized profile of image pixels. A closeness of fit between the curve and the idealized profile is determined and then intensity values are discarded from one or more of the intensity bins. The remaining intensity values are redistributed and the process is repeated several times. A determination is then made as to which curve has the closest fit with the idealized profile.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: September 8, 2015
    Assignee: Dynex Technologies, Inc.
    Inventor: Dean Eric Sequera
  • Method of Analysing Reagent Beads
    Publication number: 20140052382
    Abstract: A method of analysing reagent beads retained in a sample well of a sample plate is disclosed comprising obtaining an image of a reagent bead, distributing intensity values of image pixels amongst a plurality of intensity bins and generating an histogram. A curve is fitted to the histogram and the curve is compared with an idealised profile of image pixels. A closeness of fit between the curve and the idealised profile is determined and then intensity values are discarded from one or more of the intensity bins. The remaining intensity values are redistributed and the process is repeated several times. A determination is then made as to which curve has the closest fit with the idealised profile.
    Type: Application
    Filed: April 20, 2012
    Publication date: February 20, 2014
    Applicant: Dynex Technologies inc.
    Inventors: Adrian Bunce, Dean Eric Sequera