Abstract: A method for cooling electronic equipment. The method including propagating air through a first electronic component of the electronic equipment into a first enclosed area, where propagating the air through the first electronic component cools the first electronic component, circulating a refrigerant in a cooling loop, where the cooling loop comprises a heat exchanger, and propagating the air out of the first enclosed area by passing through the heat exchanger into a second enclosed area, where the air is cooled by passing through the heat exchanger.

Abstract: A method for cooling electronic equipment. The method including propagating air through a first electronic component of the electronic equipment into a first enclosed area, where propagating the air through the first electronic component cools the first electronic component, circulating a refrigerant in a cooling loop, where the cooling loop comprises a heat exchanger, and propagating the air out of the first enclosed area by passing through the heat exchanger into a second enclosed area, where the air is cooled by passing through the heat exchanger.

Abstract: An apparatus for testing computer chips and their assopciated system in their normal operating environment is disclosed. The elements of the apparatus including the receiving elements, the mounting elements and the test equipment coupling elements are disposed on a circuit board in a manner allowing the apparatus mounted with the removed computer chips, to be mounted to a host board in a manner, thereby enabling the comptuer chips to be tested without having to tilt or otherwise move the host board. As a result, testing of the computer chips is accomplished in a more efficient and cost effective manner.