Patents by Inventor Dean J. Maurer

Dean J. Maurer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5353003
    Abstract: A force sensor is provided which incorporates a pressure transducer disposed within a housing structure. A force transmitting means, such as a shaft slidable within an opening, is provided to communicate force from an external source to a diaphragm of a pressure sensor. An elastomeric conductor is disposed between electronic components on the diaphragm of a pressure sensor die and conductive leads that are used to communicate signals from the pressure sensor die to components external to the present invention. In certain preferred embodiments, the present invention provides a preselected quantity of resilient material between a first end of the slidable shaft and the diaphragm of the pressure sensor die. Other embodiments place the first end of the shaft in direct contact with the diaphragm.
    Type: Grant
    Filed: October 16, 1992
    Date of Patent: October 4, 1994
    Assignee: Honeywell Inc.
    Inventor: Dean J. Maurer
  • Patent number: 5351550
    Abstract: A pressure transducer is provided with a housing member that attaches to a rigid and generally planar member, such as a ceramic circuit board. The legs of the housing member can pass through holes in the circuit board or, alternatively, can attach to edges thereof. The legs of the housing are provided with bails which have steps shaped to seize the circuit board after the legs are flexed to permit insertion of the board between them. The housing is provided with an opening that is shaped to receive a media seal, a pressure sensor die and a conductive seal between a surface of the opening and a surface of the ceramic circuit board. When the circuit board is attached to the housing, the seals and the pressure sensor die are compressed therebetween to provide good fluid sealing association between the components and to also provide electrical communication between components on the pressure sensor die and components on the circuit board.
    Type: Grant
    Filed: October 16, 1992
    Date of Patent: October 4, 1994
    Assignee: Honeywell Inc.
    Inventor: Dean J. Maurer
  • Patent number: 5184107
    Abstract: A low cost piezoresistive pressure transducer utilizing premolded elastomeric seals in which at least one seal is electrically conductive. A piezoresistive stress sensitive element in the form of a diaphragm of semiconductor material having a thickened rim is held at its rim between a pair of premolded elastomeric seals in a two piece housing. Electrical connections with external circuitry are made by conductive paths through one of the elastomeric seals which makes contact with electrical leads which pass through the housing wall.
    Type: Grant
    Filed: January 24, 1992
    Date of Patent: February 2, 1993
    Assignee: Honeywell, Inc.
    Inventor: Dean J. Maurer