Abstract: A radio frequency identification (“RFID”) system and method of operating the same. In one embodiment, the RFID system includes a portable structure including a frame with a base supported by a plurality of wheels, an antenna tower and at least one removable shelf therein. The RFID system also includes an RFID reader located on the at least one removable shelf and at least one antenna mounted on the antenna tower and coupled to the RFID reader. The RFID system still further includes a computer system located on the at least one removable shelf and coupled to the RFID reader, and a power subsystem located on the at least one removable shelf and coupled to the RFID reader and the computer system.

Abstract: A radio frequency identification (“RFID”) system and method of operating the same. In one embodiment, the RFID system includes a portable structure including a frame with a base supported by a plurality of wheels, an antenna tower and at least one removable shelf therein. The RFID system also includes an RFID reader located on the at least one removable shelf and at least one antenna mounted on the antenna tower and coupled to the RFID reader. The RFID system still further includes a computer system located on the at least one removable shelf and coupled to the RFID reader, and a power subsystem located on the at least one removable shelf and coupled to the RFID reader and the computer system.

Abstract: A radio frequency identification (“RFID”) application system for use with an RFID system adapted to apply an RFID tag to a product and method of operating the same. In one embodiment, the RFID application system includes a printer applicator controller configured to manage an operation of a printer applicator of the RFID system. The RFID application system also includes a compliance manager configured to coordinate RFID compliance data to derive a unique identification number for the RFID tag. The RFID application system still further includes an event manager configured to coordinate an operation of the printer applicator controller to facilitate proper placement of the RFID tag on the product.

Abstract: A radio frequency identification (“RFID”) reader, system and object, and methods of operating and manufacturing the same. In one embodiment, the RFID object includes a container having an interior wall, an exterior wall and a cavity therebetween. The RFID object also includes an RFID tag located within the cavity. In another embodiment, the RFID object includes a container having an interior wall and an exterior wall. The RFID object also includes a first RFID tag attached to the interior wall, and a second RFID tag attached to the exterior wall.

Abstract: A radio frequency identification (RFID) tag and method of forming the same are presented. In one embodiment, the RFID tag includes an integrated circuit located in a carrier and an adhesive coupled to the carrier. The RFID tag also includes a strain relief member coupled to the adhesive on a surface opposite the carrier and an encapsulant surrounding the carrier, the adhesive and the strain relief member.

Abstract: A method of making a microelectronic circuit and the connection pattern therefor including the steps of providing a substrate (3), preferably silicon and preferably including a layer of nickel (38) under a layer of gold (36) thereon. Regions are formed on the substrate for connection of electrical components to the substrate using a first metallurgy, preferably gold and a pattern of bumps (5, 7) is formed of a second metallurgy different from the first metallurgy, preferably lead/tin solder. An interconnection pattern is formed on the substrate contacting at least one bump and at least one pad. The pattern of solder bumps is formed by providing a coupon (31) and patterning the bumps on the coupon and applied to the substrate while attached to the coupon, then heated to cause flow of the bumps onto the substrate. The coupon is then removed from the bumps with the bumps remaining on the substrate.

Abstract: The multi-chip circuit module of the invention comprises a plurality of circuit chips assembled in a laminated stack. Each chip includes a plurality of layers of thin film interconnect patterns in the normal configuration, except for the final layer or layers, which comprise a reroute pattern that locates all circuit input and output pads along a single edge of each chip. The relocated pads are provided with contact bumps to facilitate the addition of a bonded lead to each I/O pad extending therefrom to a point beyond the edge of each chip. Thus, upon lamination the protruding tips form an array of leads on a single lateral face of the laminated chip stack.

Abstract: Disclosed is a burn-in test socket which serves as a temporary package for integrated circuit die, multichip hybrid or a complete wafer without damaging the bonding pads or insulating passivation on the die during test and burn-in.