Abstract: Embodiments include but are not limited to apparatuses and systems including a microelectronic device including a die having an active surface, a conductive pillar formed on the active surface of the die, the conductive pillar having a side surface, and a molding material encasing the die and the conductive pillar, including covering the active surface of the die and the side surface of the conductive pillar. Methods for making the same also are described.

Abstract: One embodiment of n electromagnetically shielded electronic package includes a substrate having an exposed surface, a grounding structure at least partially exposed on the exposed surface and at least one electrical component positioned on the exposed surface, a conductive structure secured to the exposed surface and in contact with the grounding structure, a non-conductive layer formed on the exposed surface and covering the at least one electrical component and at least partially covering the conductive structure, and a conductive layer formed on the non-conductive layer and in contact with the conductive structure.

Abstract: A method of separating die on a substrate to reduce backside chipping. Two or more microelectronic components are created on a first side of a substrate, wherein a space exists between adjacent components. A trench is created in the other side of the substrate, wherein the location of the trench coincides with a location of the space between components on the first side of the substrate, and wherein the trench has a depth less than the thickness of the substrate. The substrate material starting at the surface of the first side in the space between the components is removed until reaching at least the trench, to separate the substrate into two or more pieces.