Patents by Inventor Dean Paul Kossives
Dean Paul Kossives has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20140303043Abstract: A reversible reaction sensor provides for detecting medical, biologic or explosive airborne compounds. The sensor may be formed in semiconductor material and is activated by radiation from sources to provide sensing of particular airborne compounds optically detectable by detectors, and reversed by other radiation from a source (or removal of activating radiation) to take away such airborne compounds from the sensor. The reversible reaction sensor device has a sensing material of one or more photo-chromic or photo-biologic compounds for a specific compound(s) or analytic(s) having receptor sites which bound molecularly to specific compound(s) or analytic(s) when present, in which sensing relies only on the response time to saturation for the sensing material as measured by an optical property of the sensing material when exposed to radiation.Type: ApplicationFiled: June 26, 2014Publication date: October 9, 2014Inventor: Dean Paul Kossives
-
Publication number: 20110171084Abstract: A reversible reaction sensor provides for detecting medical, biologic or explosive airborne compounds. The sensor may be formed in semiconductor material and is activated by radiation from sources to provide sensing of particular airborne compounds optically detectable by detectors, and reversed by other radiation from a source (or removal of activating radiation) to take away such airborne compounds from the sensor. The reversible reaction sensor device has a sensing material of one or more photo-chromic or photo-biologic compounds for a specific compound(s) or analytic(s) having receptor sites which bound molecularly to specific compound(s) or analytic(s) when present, in which sensing relies only on the response time to saturation for the sensing material as measured by an optical property of the sensing material when exposed to radiation.Type: ApplicationFiled: September 2, 2010Publication date: July 14, 2011Inventor: Dean Paul Kossives
-
Patent number: 7733661Abstract: A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive component is formed on the first side. The passive component is formed free of the ground plane. An active component is attached to the first side.Type: GrantFiled: February 25, 2009Date of Patent: June 8, 2010Assignee: Stats Chippac Ltd.Inventors: Dean Paul Kossives, Byung Joon Han
-
Publication number: 20090161330Abstract: A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive component is formed on the first side. The passive component is formed free of the ground plane. An active component is attached to the first side.Type: ApplicationFiled: February 25, 2009Publication date: June 25, 2009Inventors: Dean Paul Kossives, Byung Joon Han
-
Patent number: 7525812Abstract: A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive component is formed on the first side. The passive component is formed free of the ground plane. An active component is attached to the first side.Type: GrantFiled: October 23, 2007Date of Patent: April 28, 2009Assignee: STATS ChipPAC Ltd.Inventors: Dean Paul Kossives, Byung Joon Han
-
Patent number: 7304859Abstract: A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive component is formed on the first side. The passive component is formed free of a ground plane. An active component is attached to the first side.Type: GrantFiled: March 30, 2006Date of Patent: December 4, 2007Assignee: Stats Chippac Ltd.Inventors: Dean Paul Kossives, Byung Joon Han
-
Patent number: 7091469Abstract: An optoelectronic sensor is attached to an optically transparent substrate, such as glass, and encapsulated to form an optoelectronic device. An optical assembly can be mounted opposite the optoelectronic sensor. Filters and refractive index matching materials may be included between the optoelectronic sensor and the optically transparent substrate.Type: GrantFiled: May 20, 2004Date of Patent: August 15, 2006Assignee: ST Assembly Test Services Ltd.Inventors: Dean Paul Kossives, Kambhampati Ramakrishna, Edward Lap Zak Law, Diane Sahakian, Theodore G. Tessier, Jamin Ling
-
Patent number: 6683384Abstract: The specification describes integrated circuit air isolated crossover interconnections designed for flip chip multi-chip module interconnection technology. The crossovers are made using a crossover interconnection substrate separate from the interconnection substrate of the integrated circuit. In one embodiment the integrated circuit is flip chip bonded to a multi-chip or multi-component interconnection substrate, and the crossover interconnections are made through solder bumps or balls soldered to a conductive layer on the crossover interconnection substrate. In another embodiment the crossover is made via a crossover substrate flip chip bonded to an integrated circuit mounted on a multi-chip or multi-component interconnection substrate.Type: GrantFiled: October 8, 1997Date of Patent: January 27, 2004Assignee: Agere Systems INCInventors: Dean Paul Kossives, Fan Ren, King Lien Tai
-
Patent number: 6560735Abstract: The specification describes an IC test apparatus having a test bed with sockets adapted to engage arrays of I/O solder balls/bumps on the IC chip. In one embodiment the sockets are provided with through holes to interconnect the solder bumps to the next board level with minimum electrical path length thereby reducing parasitic capacitive coupling. In another embodiment the sockets in the test bed are formed by intersecting V-grooves. If pairs of intersecting V-grooves are used, pyramid shaped features are produced at the bottom of each socket. Both the sharp edges formed by the intersecting V-grooves and the pyramid provide contact enhancement between the solder bumps and the test bed. The test bed can be made as a universal blank for a given solder bump pitch. The desired test circuit is formed at the next board level.Type: GrantFiled: August 3, 1999Date of Patent: May 6, 2003Assignee: Agere Systems IncInventors: Louis Nelson Ahlquist, Yinon Degani, Jericho J. Jacala, Dean Paul Kossives, King Lien Tai
-
Patent number: 6370766Abstract: The specification describes methods for the manufacture of printed circuit cards which allow for final testing, including burn-in if required, of multiples of printed circuit cards as an integrated process panel prior to final packaging and singulation. This desired sequence of operations is made possible by the addition of arrays of test contacts at the edge of the integrated process panel where the test contacts can be accessed with an insertion test apparatus.Type: GrantFiled: February 28, 1997Date of Patent: April 16, 2002Assignee: Lucent Technologies Inc.Inventors: Yinon Degani, Thomas Dixon Dudderar, Dean Paul Kossives, Yee Leng Low
-
Patent number: 6297551Abstract: The specification describes a recessed chip MCM package with integrated electromagnetic shielding. The surfaces of the cavity which houses the IC devices are coated with metallization. The normally exposed top and side surfaces of the MCM package are also metallized. A solder wall is provided on the interconnect PCB which seals the gap between the MCM tile and the PCB interconnect substrate. The solder wall can be formed using standard solder bump technology, and the seal between the MCM and the PCB may be made during the same reflow operation that is used to flip-chip bond the MCM tile to the PCB.Type: GrantFiled: September 22, 1999Date of Patent: October 2, 2001Assignee: Agere Systems Guardian Corp.Inventors: Thomas Dixon Dudderar, Dean Paul Kossives, Yee Leng Low
-
Patent number: 6232212Abstract: The specification describes techniques for applying solder bumps to IC chips. The solder bump sites are first provided with under bump metallization (UBM) for solder bump interconnections to the Al bonding sites on the IC chip. The substrate, i.e. the capping layer of the IC chip, is coated with photoresist and patterned to expose the UBM and a peripheral portion of the capping layer around the UBM. The solder paste is then applied and reflowed to form the solder bump. Since the photoresist hardens and becomes difficult to remove after the reflow step, a sacrificial buffer layer is interposed between the photoresist and the capping layer to facilitate removal of the photoresist without attacking the IC chip surface.Type: GrantFiled: February 23, 1999Date of Patent: May 15, 2001Assignee: Lucent TechnologiesInventors: Yinon Degani, Dean Paul Kossives
-
Patent number: 5778913Abstract: Cleaning of a micromimiature high-density flip-chip assembly is carried out by spinning the assembly while applying cleaning fluid to a central portion of the assembly. Confinement of the cleaning fluid to a critical interconnection space of the assembly is ensured by a centrally apertured cover that resiliently engages the top of the assembly. During spinning, cleaning fluid is introduced through the aperture in the cover and is directed into and confined to flow radially in the interconnection space.Type: GrantFiled: February 20, 1997Date of Patent: July 14, 1998Assignee: Lucent Technologies Inc.Inventors: Yinon Degani, Thomas Dixon Dudderar, Dean Paul Kossives