Patents by Inventor Dean Percy

Dean Percy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070162446
    Abstract: A method of testing a multi-processor unit microprocessor. The method includes: (a) selecting and testing, with a selected parameter set of a group of parameter sets, a processor unit of a microprocessor having two or more processor units; (b) comparing the operation of the selected processor unit to a selected specification of a set of operational specifications of the microprocessor; (c) if the testing indicates that the operation of the selected processor unit does not meet the selected specification, repeating (a) and (b) with a different parameter set of the group of parameter sets until either the selected processor unit meets the selected specification or all parameter sets of the group of parameter sets have been selected; and (d) if the operation of the selected processor unit does meet the selected specification, repeating (a), (b) and (c) until all processor units have been selected.
    Type: Application
    Filed: January 12, 2006
    Publication date: July 12, 2007
    Inventors: David Appenzeller, Frances Clougherty, James Garris, Kort Longenbach, Bruce Ogilvie, Dean Percy, Norman Rohrer, William Tanona, Mario Theberge, Jin Wu
  • Publication number: 20050222792
    Abstract: A method is disclosed of temperature compensation for measurement of a temperature sensitive parameter of semiconductor IC chips, particularly temperature compensation for a maximum frequency measurement (Fmax) and speed sort/categorization of semiconductor IC chips. The method comprises determining a change of a temperature sensitive parameter of the chip with temperature; measuring the temperature sensitive parameter of the chip during testing of the chip; measuring the chip temperature directly during or following the measurement of the temperature sensitive parameter; and determining an adjusted temperature sensitive parameter of the chip based upon the measured temperature sensitive parameter of the chip during testing, the measured chip temperature, and the determined change of the temperature sensitive parameter of the chip with temperature.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 6, 2005
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jennifer Appleyard, Troy Carlson, Joseph Forbes, Dean Percy, Norman Rohrer, William Tanona