Abstract: An internal gas distributor for a container includes a stagnation plate that provides an impinging surface for gas flowing through a gas inlet of a container. The internal gas distributor further includes a guide vane weir that is disposed of downstream of the stagnation plate. The guide vane weir includes guide vanes disposed on an internal periphery of the first guide vane weir configured to deflect gas to a predefined angular range and slots configured to enable gas to travel in an undeflected manner. Various custom-designed internal gas distributors suited for various containers and/or applications are possible. The internal gas distributor provides a uniform and consistent gas flow for the container.

Abstract: A method of manufacturing a printed circuit board is provided, comprising: 1) imprinting an electrically conductive circuit pattern on a surface of a substrate; 2) applying a surface treatment composition to the surface of the substrate over the electrically conductive circuit pattern; and 3) allowing the surface treatment composition to form a self-assembled coating layer on the surface of the substrate in the form of a conformal coating. The surface treatment composition comprises: (a) a fluorine-containing polymer; (b) a solvent containing at least one C—F bond; and (c) a rheology modifying component. Also provided are electronic components of a circuit assembly and printed circuit boards, comprising a substrate and a self-assembled coating layer applied to at least one surface of the substrate. The coating layer is in the form of a conformal coating and is formed from the surface treatment composition described above.

Abstract: A method of manufacturing a printed circuit board is provided, comprising: 1) imprinting an electrically conductive circuit pattern on a surface of a substrate; 2) applying a surface treatment composition to the surface of the substrate over the electrically conductive circuit pattern; and 3) allowing the surface treatment composition to form a self-assembled coating layer on the surface of the substrate in the form of a conformal coating. The surface treatment composition comprises: (a) a fluorine-containing polymer; (b) a solvent containing at least one C—F bond; and (c) a rheology modifying component. Also provided are electronic components of a circuit assembly and printed circuit boards, comprising a substrate and a self-assembled coating layer applied to at least one surface of the substrate. The coating layer is in the form of a conformal coating and is formed from the surface treatment composition described above.

Abstract: A method of manufacturing a printed circuit board is providedd, comprising: 1) imprinting an electrically conductive circuit pattern on a surface of a substrate; 2) applying a surface treatment composition to the surface of the substrate over the electrically conductive circuit pattern; and 3) allowing the surface treatment composition to form a self-assembled coating layer on the surface of the substrate in the form of a conformal coating. The surface treatment composition comprises: (a) a fluorine-containing polymer; (b) a solvent containing at least one C-F bond; and (c) a rheology modifying component. Also provided are electronic compoennts of a circuit assembly and printed circuit boards, comprising a substrate and a self-assembled coating layer applied to at least one surface of the substrate. The coating layer is in the form of a conformal coating and is formed from the surface treatment composition described above.

Abstract: Surface treatment compositions are provided comprising: (a) a fluorine-containing polymer; (b) a solvent containing at least one C—F bond; and (c) a rheology modifying component. Also provided are coated articles, comprising: (i) a substrate; and (ii) a self-assembled coating layer applied to at least one surface of the substrate. The self-assembled coating layer is formed from the surface treatment composition above.