Abstract: A system and method are disclosed for coating surfaces of expandable medical devices with composite coatings. Coatings are composed of various materials including, e.g., polymers and drugs. Transfer of the coatings within a patient or other host forms a drug-eluting coating that delivers time-released drugs over time for treatment of a medical condition.

Abstract: This disclosure describes the application of a supplemental corona source to provide surface charge on submicrometer particles to enhance collection efficiency and micro-structural density during electrostatic collection.

Abstract: This disclosure describes the application of a supplemental corona source to provide surface charge on submicrometer particles to enhance collection efficiency and micro-structural density during electrostatic collection.

Abstract: A system and method are disclosed for coating surfaces of expandable medical devices with composite coatings. Coatings are composed of various materials including, e.g., polymers and drugs. Transfer of the coatings within a patient or other host forms a drug-eluting coating that delivers time-released drugs over time for treatment of a medical condition.

Abstract: This disclosure describes the application of a supplemental corona source to provide surface charge on submicrometer particles to enhance collection efficiency and micro-structural density during electrostatic collection.

Abstract: Standoff generating devices, arrays, and processes are disclosed for producing standoffs of various shapes, aspect ratios, and mechanical properties on a receiving surface for production of, e.g., vacuum-insulated glass units (VIGUs).

Abstract: This disclosure describes the application of a supplemental corona source to provide surface charge on submicrometer particles to enhance collection efficiency and micro-structural density during electrostatic collection.

Abstract: Methods and an apparatus are disclosed for depositing tantalum metal films in next-generation solvent fluids on substrates and/or deposition surfaces useful, e.g., as metal seed layers. Deposition involves low valence oxidation state metal precursors soluble in liquid and/or compressible solvent fluids at liquid, near-critical, or supercritical conditions for the mixed precursor solutions. Metal film deposition is effected via thermal and/or photolytic activation of the metal precursors. The invention finds application in fabrication and processing of semiconductor, metal, polymer, ceramic, and like substrates or composites.

Abstract: A system is described for selectively depositing materials to surfaces at preselected locations and at controlled thicknesses. Materials can be further selectively deposited to sub-surfaces of composite or structured silicon wafers, e.g., for the deposition of barrier films on silicon wafer surfaces, e.g., to fill substrate feature patterns (vias). The invention finds application in such commercial processes as semiconductor chip manufacturing. The system is envisioned to provide alternatives to, or decreased need for, chemical mechanical planarization in semiconductor chip manufacturing.

Abstract: Methods are disclosed for depositing materials selectively and controllably from liquid, near-critical, and/or supercritical fluids to a substrate or surface controlling the location and/or thickness of material(s) deposited to the surface or substrate. In one exemplary process, metals are deposited selectively filling feature patterns (e.g., vias) of substrates. The process can be further used to control deposition of materials on sub-surfaces of composite or structured silicon wafers, e.g., for the deposition of barrier films on silicon wafer surfaces. Materials include, but are not limited to, overburden materials, metals, non-metals, layered materials, organics, polymers, and semiconductor materials. The instant invention finds application in such commercial processes as semiconductor chip manufacturing.

Abstract: Methods and an apparatus are disclosed for depositing tantalum metal films in next-generation solvent fluids on substrates and/or deposition surfaces useful, e.g., as metal seed layers. Deposition involves low valence oxidation state metal precursors soluble in liquid and/or compressible solvent fluids at liquid, near-critical, or supercritical conditions for the mixed precursor solutions. Metal film deposition is effected via thermal and/or photolytic activation of the metal precursors. The invention finds application in fabrication and processing of semiconductor, metal, polymer, ceramic, and like substrates or composites.

Abstract: The present invention provides compact adsorption systems that are capable of rapid temperature swings and rapid cycling. Novel methods of thermal swing adsorption and thermally-enhanced pressure swing adsorption are also described. In some aspects of the invention, a gas is passed through the adsorbent thus allowing heat exchangers to be very close to all portions of the adsorbent and utilize less space. In another aspect, the adsorption media is selectively heated, thus reducing energy costs. Methods and systems for gas adsorption/desorption having improved energy efficiency with capability of short cycle times are also described. Advantages of the invention include the ability to use (typically) 30-100 times less adsorbent compared to conventional systems.

Abstract: The present invention provides compact adsorption systems that are capable of rapid temperature swings and rapid cycling. Novel methods of thermal swing adsorption and thermally-enhanced pressure swing adsorption are also described. In some aspects of the invention, a gas is passed through the adsorbent thus allowing heat exchangers to be very close to all portions of the adsorbent and utilize less space. In another aspect, the adsorption media is selectively heated, thus reducing energy costs. Methods and systems for gas adsorption/desorption having improved energy efficiency with capability of short cycle times are also described. Advantages of the invention include the ability to use (typically) 30-100 times less adsorbent compared to conventional systems.

Abstract: The present invention provides compact adsorption systems that are capable of rapid temperature swings and rapid cycling. Novel methods of thermal swing adsorption and thermally-enhanced pressure swing adsorption are also described. In some aspects of the invention, a gas is passed through the adsorbent thus allowing heat exchangers to be very close to all portions of the adsorbent and utilize less space. In another aspect, the adsorption media is selectively heated, thus reducing energy costs. Methods and systems for gas adsorption/desorption having improved energy efficiency with capability of short cycle times are also described. Advantages of the invention include the ability to use (typically) 30-100 times less adsorbent compared to conventional systems.

Abstract: The present invention is a microchannel mass exchanger having a first plurality of inner thin sheets and a second plurality of outer thin sheets. The inner thin sheets each have a solid margin around a circumference, the solid margin defining a slot through the inner thin sheet thickness. The outer thin sheets each have at least two header holes on opposite ends and when sandwiching an inner thin sheet. The outer thin sheets further have a mass exchange medium. The assembly forms a closed flow channel assembly wherein fluid enters through one of the header holes into the slot and exits through another of the header holes after contacting the mass exchange medium.

Abstract: The present invention provides compact adsorption systems that are capable of rapid temperature swings and rapid cycling. Novel methods of thermal swing adsorption and thermally-enhanced pressure swing adsorption are also described. In some aspects of the invention, a gas is passed through the adsorbent thus allowing heat exchangers to be very close to all portions of the adsorbent and utilize less space. In another aspect, the adsorption media is selectively heated, thus reducing energy costs. Methods and systems for gas adsorption/desorption having improved energy efficiency with capability of short cycle times are also described. Advantages of the invention include the ability to use (typically) 30-100 times less adsorbent compared to conventional systems.

Abstract: A laminated microchannel device is described in which there is a unit operation process layer that has longitudinal channel. The longitudinal channel is cut completely through the layer in which the unit process operation resides. Both the device structure and method of making the device provide significant advantages in terms of simplicity and efficiency. A static mixing unit that can be incorporated in the laminated microchannel device is also described.

Abstract: The present invention is an active microchannel fluid processing unit and method of making, both relying on having (a) at least one inner thin sheet; (b) at least one outer thin sheet; (c) defining at least one first sub-assembly for performing at least one first unit operation by stacking a first of the at least one inner thin sheet in alternating contact with a first of the at least one outer thin sheet into a first stack and placing an end block on the at least one inner thin sheet, the at least one first sub-assembly having at least a first inlet and a first outlet; and (d) defining at least one second sub-assembly for performing at least one second unit operation either as a second flow path within the first stack or by stacking a second of the at least one inner thin sheet in alternating contact with second of the at least one outer thin sheet as a second stack, the at least one second sub-assembly having at least a second inlet and a second outlet.

Abstract: The present invention is a microchannel mass exchanger having a first plurality of inner thin sheets and a second plurality of outer thin sheets. The inner thin sheets each have a solid margin around a circumference, the solid margin defining a slot through the inner thin sheet thickness. The outer thin sheets each have at least two header holes on opposite ends and when sandwiching an inner thin sheet. The outer thin sheets further have a mass exchange medium. The assembly forms a closed flow channel assembly wherein fluid enters through one of the header holes into the slot and exits through another of the header holes after contacting the mass exchange medium.

Abstract: The present invention is a microchannel mass exchanger having a first plurality of inner thin sheets and a second plurality of outer thin sheets. The inner thin sheets each have a solid margin around a circumference, the solid margin defining a slot through the inner thin sheet thickness. The outer thin sheets each have at least two header holes on opposite ends and when sandwiching an inner thin sheet. The outer thin sheets further have a mass exchange medium. The assembly forms a closed flow channel assembly wherein fluid enters through one of the header holes into the slot and exits through another of the header holes after contacting the mass exchange medium.