Patents by Inventor Deana Cosmadelis

Deana Cosmadelis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automated generation of surface-mount package design
    Patent number: 10706204
    Abstract: A method of performing automated surface-mount package design includes obtaining physical inputs that include names and locations of top and bottom pins, and obtaining electrical inputs that include electrical parameters such as impedance. The method also includes automatically performing analysis and processing of the physical inputs and the electrical inputs. A design file for manufacture of the surface-mount package is automatically generated based on the performing the analysis and the processing. The design file specifies a number and material of layers of the surface-mount package.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: July 7, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jean Audet, Alain Ayotte, Franklin Baez, Anson Call, Deana Cosmadelis, Jason Lee Frankel, Kevin Grosselfinger, Roxan Lemire, Marek Andrzej Orlowski, Gilles Poitras, Paul Robert Walling
  • AUTOMATED GENERATION OF SURFACE-MOUNT PACKAGE DESIGN
    Publication number: 20200104454
    Abstract: A method of performing automated surface-mount package design includes obtaining physical inputs that include names and locations of top and bottom pins, and obtaining electrical inputs that include electrical parameters such as impedance. The method also includes automatically performing analysis and processing of the physical inputs and the electrical inputs. A design file for manufacture of the surface-mount package is automatically generated based on the performing the analysis and the processing. The design file specifies a number and material of layers of the surface-mount package.
    Type: Application
    Filed: October 2, 2018
    Publication date: April 2, 2020
    Inventors: Jean Audet, Alain Ayotte, Franklin Baez, Anson Call, Deana Cosmadelis, Jason Lee Frankel, Kevin Grosselfinger, Roxan Lemire, Marek Andrzej Orlowski, Gilles Poitras, Paul Robert Walling
  • Integrated circuit packaging with tapered striplines of constant impedance
    Patent number: 6583498
    Abstract: In a package for integrated circuits, a signal transmission line has a first segment closer to the chip that is bracketed vertically by ground planes at a first vertical distance and a second segment further from the chip that is bracketed vertically by ground planes at a second vertical distance greater than the first distance, with an aperture being formed in the ground planes at the first distance, so that those ground planes do not interfere with the impedance set by the second set of ground planes.
    Type: Grant
    Filed: August 9, 2002
    Date of Patent: June 24, 2003
    Assignee: International Business Machine Corporation
    Inventors: Edward R. Pillai, Warren D. Dyckman, Deana Cosmadelis