Patents by Inventor Deanna J. Bergstrom

Deanna J. Bergstrom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7530169
    Abstract: A method of fabricating a mandrel for electroformation of an orifice plate. An array of mask elements may be created adjacent a substrate. Surface regions of the substrate disposed generally between the mask elements may be removed, to create a base having a base surface and a plurality of pillars extending from the base surface according to the array of mask elements. Each pillar may have a perimeter defined by an orthogonal projection of one of the mask elements onto the substrate. An electrical-conduction enhancer may be deposited adjacent the base surface and terminating at least substantially at the perimeter, to create a conductive layer to support growth of the orifice plate.
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: May 12, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Deanna J. Bergstrom, Rio Rivas
  • Patent number: 7501070
    Abstract: The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.
    Type: Grant
    Filed: August 18, 2003
    Date of Patent: March 10, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shen Buswell, Deanna J. Bergstrom, Daniel Frech
  • Patent number: 7299151
    Abstract: Mircodevice processing systems. One exemplary embodiment includes a component for removing substrate material to form a feature into a first surface of a substrate, and a component for measuring a thickness of a portion of the substrate defining the feature, wherein the component for measuring is positioned proximate a second surface of the substrate that is different than the first surface.
    Type: Grant
    Filed: February 4, 2004
    Date of Patent: November 20, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David M. Braun, Deanna J. Bergstrom
  • Patent number: 7040016
    Abstract: A method of fabricating a mandrel for electroformation of an orifice plate. An array of mask elements may be created adjacent a substrate. Surface regions of the substrate disposed generally between the mask elements may be removed, to create a base having a base surface and a plurality of pillars extending from the base surface according to the array of mask elements. Each pillar may have a perimeter defined by an orthogonal projection of one of the mask elements onto the substrate. An electrical-conduction enhancer may be deposited adjacent the base surface and terminating at least substantially at the perimeter, to create a conductive layer to support growth of the orifice plate.
    Type: Grant
    Filed: October 22, 2003
    Date of Patent: May 9, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Deanna J. Bergstrom, Rio Rivas
  • Patent number: 6814431
    Abstract: The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: November 9, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shen Buswell, Deanna J. Bergstrom, Daniel Frech
  • Publication number: 20040031151
    Abstract: The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.
    Type: Application
    Filed: August 18, 2003
    Publication date: February 19, 2004
    Inventors: Shen Buswell, Deanna J. Bergstrom, Daniel Frech
  • Publication number: 20040021742
    Abstract: The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.
    Type: Application
    Filed: June 20, 2003
    Publication date: February 5, 2004
    Inventors: Shen Buswell, Deanna J. Bergstrom, Daniel Frech
  • Patent number: 6666546
    Abstract: The described embodiments relate to a slotted substrate for use in a fluid ejecting ice. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: December 23, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shen Buswell, Deanna J. Bergstrom, Daniel Frech