Abstract: A method of manufacturing interconnect bumps on electrical connectors is disclosed. The interconnect bumps are formed with mechanically interlocking structure which allows the bumps to reach a height substantially greater than prior art bumps, while remaining structurally intact. The interconnect bumps are formed using standard photolithography techniques to form the bumps in multiple interlocking portions to achieve a structurally superior interconnect bump.

Abstract: A flexible automated bonding apparatus electrically interconnects integrated circuit carriers, printed circuit boards, and other devices. A metallized interconnect pattern is deposited on the surface of the substrate. The metallized interconnects in the pattern span apertures created in the substrate using an excimer laser. Thus, the metallized interconnects can be electrically bonded through the apertures to elements lying underneath the substrate.

Abstract: An improvement in the method of preparing a coating or layer of reprographic material upon a substrate which includes the conventional steps of coating the substrate surface with a layer of resinous binder curable upon exposure to radiant energy including electron beam and ultraviolet radiation, the binder layer containing reprographic solids. The resinous binder is applied as a fluid and is irradiated until a coherent and adherent layer is formed. The method includes the steps of forceably applying and tautly maintaining a sheet of a smooth flexible film against the surface of the curable resinous binder while directing a beam of radiant energy through the sheet and onto the binder while the layer of flexible film is held thereagainst. The exposure to radiant energy is continued until the resinous binder is substantially completely cured, whereupon the sheet of flexible film is removed from the surface of the binder.