Patents by Inventor Deanna Suilmann

Deanna Suilmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a multilayer electronic circuit
    Patent number: 5727310
    Abstract: A heat resistant multilayer circuit board used in the transportation environment in cars, boats, planes, etc, having two or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, at least one of the conductive layers being affixed to a heat resistant substrate. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
    Type: Grant
    Filed: June 11, 1996
    Date of Patent: March 17, 1998
    Assignee: Sheldahl, Inc.
    Inventors: Keith L. Casson, Carol Myers, Kenneth B. Gilleo, Deanna Suilmann, Edward Mahagnoul, Marion Tibesar
  • Multilayer electronic circuit having a conductive adhesive
    Patent number: 5688584
    Abstract: A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
    Type: Grant
    Filed: September 27, 1995
    Date of Patent: November 18, 1997
    Assignee: Sheldahl, Inc.
    Inventors: Keith L. Casson, Carol Myers, Kenneth B. Gilleo, Deanna Suilmann, Edward Mahagnoul, Marion Tibesar
  • Method for electrically and mechanically connecting at least two conductive layers
    Patent number: 5502889
    Abstract: A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
    Type: Grant
    Filed: January 8, 1993
    Date of Patent: April 2, 1996
    Assignee: Sheldahl, Inc.
    Inventors: Keith L. Casson, Carol Myers, Kenneth B. Gilleo, Deanna Suilmann, Edward Mahagnoul, Marion Tibesar