Patents by Inventor DeaWhan Kim

DeaWhan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package system with cavity substrate
    Patent number: 7968371
    Abstract: A semiconductor package system is provided including providing a cavity substrate having a cavity provided therein, attaching a metal die pad to the cavity substrate, attaching a semiconductor die in the cavity to the metal die pad, and attaching solder connectors to the cavity substrate for connection on the system board with the metal die pad on the system board.
    Type: Grant
    Filed: November 18, 2005
    Date of Patent: June 28, 2011
    Assignee: STATS ChipPAC Ltd.
    Inventors: OhSug Kim, DeaWhan Kim, SangJo Kim
  • SEMICONDUCTOR PACKAGE SYSTEM WITH CAVITY SUBSTRATE
    Publication number: 20060170092
    Abstract: A semiconductor package system is provided including providing a cavity substrate having a cavity provided therein, attaching a metal die pad to the cavity substrate, attaching a semiconductor die in the cavity to the metal die pad, and attaching solder connectors to the cavity substrate for connection on the system board with the metal die pad on the system board.
    Type: Application
    Filed: November 18, 2005
    Publication date: August 3, 2006
    Applicant: STATS ChipPAC Ltd.
    Inventors: OhSug Kim, DeaWhan Kim, SangJo Kim