Patents by Inventor Debbie Forray

Debbie Forray has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mold compositions with high adhesion to metal substrates
    Patent number: 7863346
    Abstract: The invention is based on the discovery that certain well-defined crosslinkable polyester compounds are useful as components in mold compositions having increased adhesion to substrates, compared to mold compositions that do not contain the crosslinkable polyester compounds described herein.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: January 4, 2011
    Assignee: Designer Molecules, Inc.
    Inventors: Stephen M. Dershem, Debbie Forray
  • Underfill compositions and methods for use thereof
    Patent number: 7786248
    Abstract: The invention is based on the discovery that certain polyester-linked compounds are useful as components in underfill compositions for the microelectronic packaging industry.
    Type: Grant
    Filed: August 19, 2005
    Date of Patent: August 31, 2010
    Assignee: Designer Molecules, Inc.
    Inventors: Stephen M. Dershem, Debbie Forray
  • Mold compositions with high adhesion to metal substrates
    Publication number: 20070299154
    Abstract: The invention is based on the discovery that certain well-defined crosslinkable polyester compounds are useful as components in mold compositions having increased adhesion to substrates, compared to mold compositions that do not contain the crosslinkable polyester compounds described herein.
    Type: Application
    Filed: February 7, 2006
    Publication date: December 27, 2007
    Inventors: Stephen Dershem, Debbie Forray
  • Semiconductor die assembly
    Publication number: 20070176276
    Abstract: The invention is based on the discovery that certain well-defined b-stageable adhesives are useful in stacked die assemblies. In particular, the invention provides assemblies wherein the b-stageable adhesive encapsulates a portion of the wiring members contained within the bondline gap between the stacked die. In other words, the b-stageable adhesive has the ability to flow through (i.e., encapsulate) the wires as the adhesive fills the bondline gap, thereby preventing any mold compound from covering the wires.
    Type: Application
    Filed: February 1, 2006
    Publication date: August 2, 2007
    Inventors: Debbie Forray, Mario Gattuso
  • Underfill compositions and methods for use thereof
    Publication number: 20060069232
    Abstract: The invention is based on the discovery that certain polyester-linked compounds are useful as components in underfill compositions for the microelectonic packaging industry.
    Type: Application
    Filed: August 19, 2005
    Publication date: March 30, 2006
    Inventors: Stephen Dershem, Debbie Forray
  • Polyalkylsilsesquioxane-filled adhesive compositions and methods for use thereof
    Publication number: 20060063014
    Abstract: The invention is based on the discovery that polyalkylsilsesquioxanes can be used as fillers for the preparation of adhesive formulations having excellent dielectric properties, i.e., very low conductivities. Invention compositions display excellent rheological properties, in addition to low dielectric constants.
    Type: Application
    Filed: July 12, 2005
    Publication date: March 23, 2006
    Inventor: Debbie Forray