Patents by Inventor Debkalpo Das

Debkalpo Das has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for predicting film thickness using virtual metrology
    Patent number: 11989495
    Abstract: A method includes obtaining sensor data associated with a deposition process performed in a process chamber to deposit film on a surface of a substrate. The method further includes generating a plurality of physics based outputs using a transformation function and the sensor data. The method further includes mapping the physics based outputs to a training set. The method further includes training a virtual model based on the training set and the sensor data, wherein the virtual model is trained to generate predictive metrology data associated with the film.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: May 21, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Debkalpo Das, Raman K Nurani, Ramachandran Subramanian, Bibhavendra Singh, Bharath Sundar
  • SYSTEMS AND METHODS FOR PREDICTING FILM THICKNESS USING VIRTUAL METROLOGY
    Publication number: 20220207223
    Abstract: A method includes obtaining sensor data associated with a deposition process performed in a process chamber to deposit film on a surface of a substrate. The method further includes generating a plurality of physics based outputs using a transformation function and the sensor data. The method further includes mapping the physics based outputs to a training set. The method further includes training a virtual model based on the training set and the sensor data, wherein the virtual model is trained to generate predictive metrology data associated with the film.
    Type: Application
    Filed: December 31, 2020
    Publication date: June 30, 2022
    Inventor: Debkalpo Das