Abstract: A lens system includes a TIR (Total Internal Reflection) lens and a diffuser. The lens has an optical body member including an upper end, a lower end opposite the upper end, and an outer surface. The outer surface is shaped to provide total internal reflection for light from a light source. An upper surface extends in a series of steps from the upper end to a first interior portion of the optical body member. A substantially cylindrical cavity extends from the lower end to a second interior portion of the optical body member. A middle portion separates the first and second interior portions and has a flat upper surface and a curved lower surface. The diffuser has a curved shell configured for disposing over a light source and configured to fit inside the cylindrical cavity of the optical body member, the diffuser having a circular rim fused to the lower end of the optical body member.

Abstract: A lamp includes a single emitter structure having a substrate with 25 or more light emitting diodes (LEDs) arranged thereon and a power rating of 80 Watts or more, a total internal reflection (TIR) lens with a plurality of refractive surface regions disposed on the step-shaped upper surface of the optical body, and a holder having a plurality of tabs disposed along an inside rim of the holder and configured for radial compression fit with a flange of the lens, and three or more support members configured for centering the optical body member with respect to the single emitter structure.

Abstract: A total internal reflection (TIR) lens can have a back surface tapered to provide total internal reflection of light toward the front surface. The front surface can have a stepped shape defining a cavity that extends into the lens body, with a width of the cavity increasing toward a front side of the lens. The front surface can further have a convex central surface segment that extends from the front surface within a central portion of the cavity. A peripheral cover member can be formed integrally with the lens body, with a front surface extending laterally outward from an outer edge of the front surface of the lens body and a back surface extending laterally outward from an outer edge of the back surface of the lens body.

Abstract: A lens system includes a TIR (Total Internal Reflection) lens and a diffuser. The lens has an optical body member including an upper end, a lower end opposite the upper end, and an outer surface. The outer surface is shaped to provide total internal reflection for light from a light source. An upper surface extends in a series of steps from the upper end to a first interior portion of the optical body member. A substantially cylindrical cavity extends from the lower end to a second interior portion of the optical body member. A middle portion separates the first and second interior portions and has a flat upper surface and a curved lower surface. The diffuser has a curved shell configured for disposing over a light source and configured to fit inside the cylindrical cavity of the optical body member, the diffuser having a circular rim fused to the lower end of the optical body member.

Abstract: A lamp includes a single emitter structure having a substrate with 25 or more light emitting diodes (LEDs) arranged thereon and a power rating of 80 Watts or more, a total internal reflection (TIR) lens with a plurality of refractive surface regions disposed on the step-shaped upper surface of the optical body, and a holder having a plurality of tabs disposed along an inside rim of the holder and configured for radial compression fit with a flange of the lens, and three or more support members configured for centering the optical body member with respect to the single emitter structure.

Abstract: A lamp includes a single emitter structure having a substrate with 25 or more light emitting diodes (LEDs) arranged thereon and a power rating of 80 Watts or more, a total internal reflection (TIR) lens with a plurality of refractive surface regions disposed on the step-shaped upper surface of the optical body, and a holder having a plurality of tabs disposed along an inside rim of the holder and configured for radial compression fit with a flange of the lens, and three or more support members configured for centering the optical body member with respect to the single emitter structure. A low weight ratio of hardener over base resin below 6 is used, for example, between 1.5:1 to 2.5:1.

Abstract: A metal plate on a multi-die LED emitter substrate or a metal plate on a metal-core printed circuit board (MCPCB) that attaches to the emitter substrate (or both plates) can be fabricated with a number of generally radial grooves, at least some of which extend to the peripheral edge of the plate. These grooves can provide channels that allow air to escape during solder-bonding processes, reducing the size and/or total area of solder voids and thereby improving thermal transfer between the emitter and the MCPCB.

Abstract: A lamp includes a single emitter structure having a substrate with 25 or more light emitting diodes (LEDs) arranged thereon and a power rating of 80 Watts or more, a total internal reflection (TIR) lens with a plurality of refractive surface regions disposed on the step-shaped upper surface of the optical body, and a holder having a plurality of tabs disposed along an inside rim of the holder and configured for radial compression fit with a flange of the lens, and three or more support members configured for centering the optical body member with respect to the single emitter structure. A low weight ratio of hardener over base resin below 6 is used, for example, between 1.5:1 to 2.5:1.

Abstract: A metal plate on a multi-die LED emitter substrate or a metal plate on a metal-core printed circuit board (MCPCB) that attaches to the emitter substrate (or both plates) can be fabricated with a number of generally radial grooves, at least some of which extend to the peripheral edge of the plate. These grooves can provide channels that allow air to escape during solder-bonding processes, reducing the size and/or total area of solder voids and thereby improving thermal transfer between the emitter and the MCPCB.

Abstract: A parallel optical transceiver module is provided that has a heat dissipation system that dissipates large amounts of heat, while also protecting the laser diodes, ICs and other components of the module from particulates, such as dust, for example, and from mechanical handling forces. The heat dissipation system is configured to be secured to the optical subassembly (OSA) of the module such that when the OSA is secured to the upper surface of the leadframe of the module, the OSA and the heat dissipation system cooperate to encapsulate at least the laser diodes and laser diode driver IC in a way that protects these components from dust and other particulates and from external mechanical forces. The heat dissipation system of the module is disposed for coupling with an external heat dissipation system, e.g., with a heat dissipation system that is provided by the customer.

Abstract: A parallel optical transceiver module is provided that has a heat dissipation system that dissipates large amounts of heat, while also protecting the laser diodes, ICs and other components of the module from particulates, such as dust, for example, and from mechanical handling forces. The heat dissipation system is configured to be secured to the optical subassembly (OSA) of the module such that when the OSA is secured to the upper surface of the leadframe of the module, the OSA and the heat dissipation system cooperate to encapsulate at least the laser diodes and laser diode driver IC in a way that protects these components from dust and other particulates and from external mechanical forces. The heat dissipation system of the module is disposed for coupling with an external heat dissipation system, e.g., with a heat dissipation system that is provided by the customer.