Abstract: A method for producing a thixotropic curable silicone composition is provided. The curable silicone composition comprises: (A) a silicone base material comprising: an organopolysiloxane having at least two alkoxysilyl-containing groups per molecule and a filler other than fumed silica; (B) a hydrophobic fumed silica; (C) a carbasilatrane derivative; (D) an alkoxysilane or its partial hydrolysis and condensation product; and (E) a condensation reaction catalyst. The method comprises the following steps: (I) mixing components (A) and (B); (II) mixing component (C) with a mixture obtained by step (I); and (III) mixing components (D) and (E) with a mixture obtained by step (II) under free of moisture. The curable silicone composition obtained by the method has an excellent thixotropic property and can cure at room temperature by contact with moisture in air.

Abstract: A method for forming thermally conductive composition on electronic components comprises three steps, (I) preparing a silicone composition comprising (A) a polyorganosiloxane, (B) a thermally conductive filler and (C) a catalyst, (II) applying the silicone composition on an electronic component of electronic devices, the electronic component generates heat when the electronic devices are working and (III) curing the silicone composition by heat generated by the electronic component.

Abstract: A thermal conductive silicone composition comprises: (A) a liquid organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 6 carbon atoms per molecule; (B) a thermal conductive filler with an average particle size of from 5 to 50 ?m; (C) a thermal conductive filler with an average particle size of at least 0.1 ?m and less than 5 ?m; and (D) a carbasilatrane derivative. Optionally, the composition further comprises: (E) an organosiloxane having at least one silicon atom-bonded hydrogen atom per molecule; and/or (F) a hydrosilylation reaction catalyst. The composition exhibits excellent storage stability and handleability despite containing a large quantity of a thermal conductive filler to exhibit high thermal conductivity.

Abstract: A method for producing a thixotropic curable silicone composition is provided. The curable silicone composition comprises: (A) a silicone base material comprising: an organopolysiloxane having at least two alkoxysilyl-containing groups per molecule and a filler other than fumed silica; (B) a hydrophobic fumed silica; (C) a carbasilatrane derivative; (D) an alkoxysilane or its partial hydrolysis and condensation product; and (E) a condensation reaction catalyst. The method comprises the following steps: (I) mixing components (A) and (B); (II) mixing component (C) with a mixture obtained by step (I); and (III) mixing components (D) and (E) with a mixture obtained by step (II) under free of moisture. The curable silicone composition obtained by the method has an excellent thixotropic property and can cure at room temperature by contact with moisture in air.

Abstract: A method for forming thermally conductive composition on electronic components comprises three steps, (I) preparing a silicone composition comprising (A) a polyorganosiloxane, (B) a thermally conductive filler and (C) a catalyst, (II) applying the silicone composition on an electronic component of electronic devices, the electronic component generates heat when the electronic devices are working and (III) curing the silicone composition by heat generated by the electronic component