Patents by Inventor Deborah A. Ryan

Deborah A. Ryan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Triple oxide fill for trench isolation
    Patent number: 6825097
    Abstract: In an integrated circuit process for SOI including trench device isolation, the problem of voids in the trench fill is addressed by a triple fill process, in which a thermal oxide sidewall having recesses at the bottom corners is covered with a LPCVD deposition that fills in the recesses, followed by a void-free HDP deposition. Densification results in substantially the same etch rate for the three types of oxide.
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: November 30, 2004
    Assignee: International Business Machines Corporation
    Inventors: Klaus D. Beyer, Patricia A. O'Neil, Deborah A. Ryan, Peter Smeys, Effendi Leobandung
  • Triple oxide fill for trench isolation
    Publication number: 20040029352
    Abstract: In an integrated circuit process for SOI including trench device isolation, the problem of voids in the trench fill is addressed by a triple fill process, in which a thermal oxide sidewall having recesses at the bottom corners is covered with a LPCVD deposition that fills in the recesses, followed by a void-free HDP deposition. Densification results in substantially the same etch rate for the three types of oxide.
    Type: Application
    Filed: August 7, 2002
    Publication date: February 12, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Klaus D. Beyer, Patricia A. O'Neil, Deborah A. Ryan, Peter Smeys, Effendi Leobandung