Patents by Inventor Deborah D. Forray

Deborah D. Forray has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020062923
    Abstract: In accordance with the present invention, adhesive formulations have been developed which enable curing of adhesively bonded assemblies (i.e., assemblies which comprise devices which have been adhesively bonded to substrates) with dramatically reduced occurrence of void formation upon curing. In many instances, void formation can be eliminated employing invention compositions. In accordance with another aspect of the present invention, methods employing the above-described adhesive formulations are also provided, as are substantially void-free articles produced thereby.
    Type: Application
    Filed: May 24, 1999
    Publication date: May 30, 2002
    Inventor: DEBORAH D. FORRAY
  • Patent number: 5717034
    Abstract: In accordance with the present invention, it has been discovered that perfluorinated hydrocarbon polymers can be used as fillers for the preparation of adhesive formulations having excellent dielectric properties, i.e., very low conductivities. Invention compositions display excellent rheological properties, in addition to low dielectric constants. Invention formulations can be used for a variety of purposes, such as, for example, for the preparation of filled adhesive formulations with a reduced propensity to settle out, excellent dispensing characteristics due to the thixotropic nature thereof, and the like.
    Type: Grant
    Filed: July 29, 1996
    Date of Patent: February 10, 1998
    Assignee: Quantum Materials, Inc.
    Inventors: Stephen M. Dershem, Deborah D. Forray