Abstract: The invention provides a composition comprising a phosphor and a Q-containing silicone; an encapsulant formulation comprising a phosphor and a Q-containing silicone; and a device including an optoelectronic device such as LED, a phosphor, and a Q-containing silicone. The Q-containing silicone passes thermal shock condition of up to 150° C., and has many suitable properties such as transparency and viscosity to function as a phosphor binder.

Abstract: An encapsulant composition is provided. The composition includes an epoxy composition including at least two siloxane repeat units and a curing agent. The encapsulant composition is particularly suited for encapsulating light emitting diode components.

Abstract: An encapsulant composition is provided. The composition includes an epoxy composition including at least a silicone epoxy of the general formula: MaM?bDcD?dTeT?fQg wherein a, b, c, d, e, f, and g are independently integers of zero or above, and wherein the sum of b, d, and f is one or greater; M is R13SiO1/2; M? is (Z)R22SiO1/2; D is R32SiO2/2; D? is (Z)R4SiO2/2; T is R5SiO3/2; and T? is (Z)SiO3/2; Q is SiO4/2 and R1, R2, R3, R4, R5 are independently selected from the group consisting of H, C1-22 alkyl, C1-22 alkoxy, C2-22 alkenyl, C6-14 aryl, C6-22 alkyl substituted aryl, C6-22 arylalkyl, aminoalkyls, and mixtures thereof; and Z, independently at each occurrence, is an organic radical containing an epoxy group, a curing agent, and a filler. The composition is substantially free of Pt.

Abstract: A gas sensor device including a semiconductor substrate; one or more catalytic gate-electrodes deposited on a surface of the semiconductor substrate; one or more ohmic contacts deposited on the surface of the semiconductor substrate and a passivation layer deposited on at least a portion of the surface; wherein the semiconductor substrate includes a material selected from the group consisting of silicon carbide, diamond, Group III nitrides, alloys of Group III nitrides, zinc oxide, and any combinations thereof.

Abstract: A curable epoxy formulation comprising at least one epoxy monomer, at least one organofunctionalized colloidal silica, at least one alkyl onium cure catalyst, and optional reagents is provided in the present invention. Also disclosed are a packaged solid state device comprising an encapsulant comprising the aforementioned curable epoxy formulation.