Patents by Inventor Deborah L. Derfelt

Deborah L. Derfelt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bleed resistant cyanate ester-containing compositions
    Patent number: 5753748
    Abstract: In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.
    Type: Grant
    Filed: August 2, 1996
    Date of Patent: May 19, 1998
    Assignee: Quantum Materials, Inc.
    Inventors: Stephen M. Dershem, Deborah L. Derfelt
  • Bleed resistant cyanate ester-containing compositions
    Patent number: 5718941
    Abstract: In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.
    Type: Grant
    Filed: March 4, 1997
    Date of Patent: February 17, 1998
    Assignee: Quantum Materials, Inc.
    Inventors: Stephen M. Dershem, Deborah L. Derfelt
  • Bleed resistant cyanate ester-containing compositions
    Patent number: 5646241
    Abstract: In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: July 8, 1997
    Assignee: Quantum Materials, Inc.
    Inventors: Stephen M. Dershem, Deborah L. Derfelt
  • Solvent free die-attach compositions
    Patent number: 5447988
    Abstract: In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler, and a curing catalyst, in the substantial absence of alkylphenol. The recognition that attach paste compositions are effective without the addition of alkylphenol has the benefit of reducing the cost of preparation, as well as the ease of preparation of die attach pastes containing electrically conductive filler and polycyanate ester monomer. The incorporation of alkylphenol into die-attach paste compositions has been found to be unnecessary, due to the presence of catalytically active species on the surface of filler flake employed in the preparation of such pastes.
    Type: Grant
    Filed: November 23, 1993
    Date of Patent: September 5, 1995
    Assignee: Quantum Materials
    Inventors: Stephen M. Dershem, Dennis B. Patterson, Deborah L. Derfelt
  • Die-attach composition comprising polycyanate ester monomer
    Patent number: 5358992
    Abstract: In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler rendered substantially free of catalytically active metal ions and a curing catalyst. Treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.
    Type: Grant
    Filed: February 26, 1993
    Date of Patent: October 25, 1994
    Assignee: Quantum Materials, Inc.
    Inventors: Stephen M. Dershem, Deborah L. Derfelt, Dennis B. Patterson