Patents by Inventor Deborah L. Thompson

Deborah L. Thompson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PROK2 ANTAGONISTS AND METHODS OF USE
    Publication number: 20080219985
    Abstract: The present invention provides methods of using PROK2 and PROK1 antagonist, including monoclonal antibodies to treat inflammation, angiogenesis, and cancer.
    Type: Application
    Filed: September 13, 2006
    Publication date: September 11, 2008
    Inventors: Penny J. Thompson, Anthony W. Siadak, Claire R. Noriega, Henry R. Franklin, Secil Oguz, Deborah L. Thompson, Stavros Topouzis, Joachim Fruebis, Kenneth Brasel, Yue Yao
  • Windowed package having embedded frame
    Patent number: 7223631
    Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.
    Type: Grant
    Filed: February 22, 2006
    Date of Patent: May 29, 2007
    Assignee: Intel Corporation
    Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
  • Windowed package having embedded frame
    Patent number: 7026707
    Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.
    Type: Grant
    Filed: February 11, 2004
    Date of Patent: April 11, 2006
    Assignee: Intel Corporation
    Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
  • Windowed package having embedded frame
    Publication number: 20040159902
    Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.
    Type: Application
    Filed: February 11, 2004
    Publication date: August 19, 2004
    Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
  • Windowed non-ceramic package having embedded frame
    Patent number: 6692993
    Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.
    Type: Grant
    Filed: April 10, 2000
    Date of Patent: February 17, 2004
    Assignee: Intel Corporation
    Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
  • Windowed non-ceramic package having embedded frame
    Publication number: 20020125552
    Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.
    Type: Application
    Filed: April 10, 2000
    Publication date: September 12, 2002
    Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
  • Mass reflowable windowed package
    Patent number: 6191359
    Abstract: A windowed package is capable of withstanding a mass reflow process. During mass reflow, the entire package is subjected to the solder reflow temperature. In one embodiment, the lid comprises a ceramic frame and a glass window.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: February 20, 2001
    Assignee: Intel Corporation
    Inventors: Kabul S. Sengupta, Carl E. Sklenicka, Deborah L. Thompson, Raul A. Arellano, Naoyuki Nagai, Nobuyuki Takehashi, Kouichiro Nomoto
  • Windowed non-ceramic package having embedded frame
    Patent number: 6072232
    Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: June 6, 2000
    Assignee: Intel Corporation
    Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson