Patents by Inventor Deborah S. Kaller

Deborah S. Kaller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Implementing micro BGA assembly techniques for small die
    Patent number: 6655022
    Abstract: A method of implementing a micro BGA is introduced. More specifically, the method discloses packaging an integrated circuit into an integrated circuit assembly. The method first mounts polyimide tape to a lead frame. The polyimide tape serves as a substrate for the integrated circuit package. Next, a piece of elastomer is coupled to said polyimide tape. Then an integrated circuit die is attached to said elastomer. Lead beams are then bonded from bond pads on said die to said lead frame. Solder balls are attached to said lead frame. The attached solder balls may be located beyond the area of said die.
    Type: Grant
    Filed: September 24, 1998
    Date of Patent: December 2, 2003
    Assignee: Intel Corporation
    Inventors: Steven R. Eskildsen, Richard B. Foehringer, Deborah S. Kaller
  • Implementing micro BGA™ assembly techniques for small die
    Patent number: 6489557
    Abstract: The present invention introduces a method of implementing micro BGA. More specifically, the present invention discloses a method of packaging an integrated circuit into an integrated circuit assembly. The method of the present invention first mounts polyimide tape to a lead frame. The polyimide tape serves as a substrate for the integrated circuit package. Next, a piece of elastomer is coupled to said polyimide tape. Then an integrated circuit die is attached to said elastomer. Lead beams are then bonded from bond pads on said die to said lead frame. Solder balls are attached to said lead frame. The attached solder balls may be located beyond the area of said die.
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: December 3, 2002
    Assignee: Intel Corporation
    Inventors: Steven R. Eskildsen, Richard B. Foehringer, Deborah S. Kaller
  • IMPLEMENTING MICRO BGATM ASSEMBLY TECHNIQUES FOR SMALL DIE
    Publication number: 20020079120
    Abstract: The present invention introduces a method of implementing micro BGA. More specifically, the present invention discloses a method of packaging an integrated circuit into an integrated circuit assembly. The method of the present invention first mounts polyimide tape to a lead frame. The polyimide tape serves as a substrate for the integrated circuit package. Next, a piece of elastomer is coupled to said polyimide tape. Then an integrated circuit die is attached to said elastomer. Lead beams are then bonded from bond pads on said die to said lead frame. Solder balls are attached to said lead frame. The attached solder balls may be located beyond the area of said die.
    Type: Application
    Filed: August 30, 1999
    Publication date: June 27, 2002
    Inventors: STEVEN R. ESKILDSEN, RICHARD B. FOEHRINGER, DEBORAH S. KALLER