Patents by Inventor Deborah V. Hirst

Deborah V. Hirst has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless copper compositions
    Patent number: 7611569
    Abstract: Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: November 3, 2009
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
  • Electroless copper and redox couples
    Patent number: 7527681
    Abstract: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: May 5, 2009
    Assignee: Rohm and Haas Electronic Materials LLP
    Inventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
  • Formaldehyde free electroless copper compositions
    Patent number: 7501014
    Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: March 10, 2009
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
  • Compositions containing heterocylcic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous material
    Publication number: 20030021887
    Abstract: A heterocyclic nitrogen and glycol containing solvent swell composition and method of using the composition. The solvent swell compositions may contain high flash point solvents and water. The solvent swell composition is used to condition resinous material for etching to form a porous textured surface on the resinous material. The porous texture permits the deposition of a metal on the resinous material such that a high integrity bond is formed between the textured resinous material and the deposited metal. Such a bond between the metal and the resinous material prevents de-lamination of the metal and resin bond. The heterocyclic nitrogen and glycol solvent swell composition also desmears resin material from substrates. The heterocyclic and glycol solvent swell compositions may be employed to treat resinous material used in the manufacture of printed wiring boards. Metal may be deposited on the textured resinous material by suitable plating methods.
    Type: Application
    Filed: March 8, 2002
    Publication date: January 30, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: John E. Graves, Varinder Chohan, Deborah V. Hirst, Mark A. Poole
  • Solvent swell for texturing resinous material and desmearing and removing resinous material
    Publication number: 20030015498
    Abstract: A lactone solvent swell composition and method of using the composition. The lactone swell composition is used to condition resinous material for etching to form a porous textured surface on the resinous material. The porous texture permits the deposition of a metal on the resinous material such that a high integrity bond is formed between the textured resinous material and the deposited metal. Such a bond between the metal and the resinous material prevents de-lamination of the metal and resin bond. The lactone solvent swell compositions also desmear resin material from substrates. The lactone solvent swell compositions may be employed to treat resinous material used in the manufacture of printed wiring boards. Metal may be deposited on the textured resinous material by electroless plating.
    Type: Application
    Filed: February 22, 2002
    Publication date: January 23, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Deborah V. Hirst, Mark A. Poole, Susan Green, Inna Sinitskaya, John E. Graves