Abstract: A semiconductor device and method of making same which includes a semiconductor substrate having a moat region with an ion implant in the moat region and a window in the substrate spaced from the moat region, electrically decoupled therefrom and having an ion implant therein in the form of a predetermined pattern. The moat region can contain one or more active and/or passive components therein. The method of fabrication comprises providing a semiconductor wafer, forming a moat region and an associated window region on the wafer, forming at least portions of electrical devices in the moat region by implanting ions therein, forming a predetermined non-electrical component pattern in the window by implanting ions in the window concurrently with the implanting of ions in the moat and completing fabrication of at least one electrical component in the moat region.

Abstract: A semiconductor device and method of making same which includes a semiconductor substrate having a moat region with an ion implant in the moat region and a window in the substrate spaced from the moat region, electrically decoupled therefrom and having an ion implant therein in the form of a predetermined pattern. The moat region can contain one or more active and/or passive components therein. The method of fabrication comprises providing a semiconductor wafer, forming a moat region and an associated window region on the wafer, forming at least portions of electrical devices in the moat region by implanting ions therein, forming a predetermined non-electrical component pattern in the window by implanting ions in the window concurrently with the implanting of ions in the moat and completing fabrication of at least one electrical component in the moat region.

Abstract: A semiconductor device and method of making same which includes a semiconductor substrate having a moat region with an ion implant in the moat region and a window in the substrate spaced from the moat region, electrically decoupled therefrom and having an ion implant therein in the form of a predetermined pattern. The moat region can contain one or more active and/or passive components therein. The method of fabrication comprises providing a semiconductor wafer, forming a moat region and an associated window region on the wafer, forming at least portions of electrical devices in the moat region by implanting ions therein, forming a predetermined non-electrical component pattern in the window by implanting ions in the window concurrently with the implanting of ions in the moat and completing fabrication of at least one electrical component in the moat region.

Abstract: A structure and method for improving the sense margin of nonvolatile memories is disclosed. An improvement to the sense margin of nonvolatile memories is accomplished by improving the margin both for "ones" at low control gate voltage Vcc and for "zeros" at high control gate voltage Vcc. Improvement in sensing at low control gate voltages Vcc is accomplished by skewing the sense amplifier response characteristics by forming the channel length of the reference memory cell to have a longer channel length than the memory cells of the array.

Abstract: The memory array circuit this invention provides connection of segmented bitlines to bitline decoding circuitry while, at the same time, providing connection of combined wordlines wordline decoding circuitry. The segmentation and decoding connections permit faster speed of operation with minimal or no area penalty. The area penalty is avoided by driving common wordlines in each of the segments, effectively increasing the wordline pitch at the wordline decoder, while at the same time decreasing the number of wordline decodes required. The segmentation also permits location of the decoder circuit away from the signal and routing decode outputs.

Abstract: A driver circuit for applying both read and program voltages to a wordline of an integrated-circuit memory-cell logic array. The driver circuit is comprised of a series driver transistor pair, of a driver enabling means for enabling and disenabling one of the transistors of the driver transistor pair, and of a latching means. The driver transistor used during read operation may be constructed with a relatively short source-drain channel, permitting faster access speed during read operation of the circuit.

Abstract: An electrically programmable semiconductor memory device of a type having an array of programmable semiconductor floating gate transistors sets of which are coupled between associated respective source and drain lines, an array programming control transistor and a ground select transistor coupled to each of the drain and source lines. Each selected floating gate transistor in a programming mode is in series with control and ground select transistors between a high voltage Vpp and ground potential. A resistive element in series with a first conducting circuit element establishes a reference current which generates a voltage V.sub.1 at the junction of the resistive element and the circuit element. In a second current leg a second conducting circuit element, a module floating gate transistor biased into a conducting state and a module control transistor are all connected between Vpp and ground such that a voltage V.sub.