Patents by Inventor Debra L. Scherber

Debra L. Scherber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing slurry for metal layers and films
    Patent number: 5858813
    Abstract: A polishing slurry for chemically mechanically polishing metal layers and films during the various stages of multilevel interconnect fabrication associated with integrated circuit manufacturing. The slurry includes an aqueous medium, an abrasive, an oxidizing agent, and an organic acid. The polishing slurry has been found to significantly lower or inhibit the silicon dioxide polishing rate, thus yielding enhanced selectivity. In addition, the polishing slurry is useful in providing effective polishing to metal layers at desired polishing rates while minimizing surface imperfections and defects.Also disclosed is a method for producing coplanar metal/insulator films on a substrate utilizing the slurry of the present invention and chemical mechanical polishing technique relating thereto.
    Type: Grant
    Filed: May 10, 1996
    Date of Patent: January 12, 1999
    Assignee: Cabot Corporation
    Inventors: Debra L. Scherber, Vlasta Brusic Kaufman, Rodney C. Kistler, Brian L. Mueller, Christopher C. Streinz
  • Chemical mechanical polishing slurry for metal layers
    Patent number: 5527423
    Abstract: A slurry for use in chemical-mechanical polishing of a metal layer comprising high purity fine metal oxide particles uniformly dispersed in a stable aqueous medium.
    Type: Grant
    Filed: October 6, 1994
    Date of Patent: June 18, 1996
    Assignee: Cabot Corporation
    Inventors: Matthew Neville, David J. Fluck, Cheng-Hung Hung, Michael A. Lucarelli, Debra L. Scherber