Publication number: 20060214221
Abstract: Various embodiments for improved power devices as well as their methods of manufacture, packaging and circuitry incorporating the same for use in a wide variety of power electronic applications are disclosed. One aspect of the invention combines a number of charge balancing techniques and other techniques for reducing parasitic capacitance to arrive at different embodiments for power devices with improved voltage performance, higher switching speed, and lower on-resistance. Another aspect of the invention provides improved termination structures for low, medium and high voltage devices. Improved methods of fabrication for power devices are provided according to other aspects of the invention. Improvements to specific processing steps, such as formation of trenches, formation of dielectric layers inside trenches, formation of mesa structures and processes for reducing substrate thickness, among others, are presented.
Type:
Application
Filed:
May 31, 2006
Publication date:
September 28, 2006
Inventors:
Ashok Challa, Alan Elbanhawy, Thomas Grebs, Nathan Kraft, Dean Probst, Rodney Ridley, Steven Sapp, Qi Wang, Chongman Yun, J.G. Lee, Peter Wilson, Joseph Yedinak, J.Y. Jung, H.C. Jang, Babak Sani, Richard Stokes, Gary Dolny, John Mytych, Becky Losee, Adam Selsley, Robert Herrick, James Murphy, Gordon Madson, Bruce Marchant, Christopher Rexer, Christopher Kocon, Debra Woolsey
Publication number: 20060214222
Abstract: Various embodiments for improved power devices as well as their methods of manufacture, packaging and circuitry incorporating the same for use in a wide variety of power electronic applications are disclosed. One aspect of the invention combines a number of charge balancing techniques and other techniques for reducing parasitic capacitance to arrive at different embodiments for power devices with improved voltage performance, higher switching speed, and lower on-resistance. Another aspect of the invention provides improved termination structures for low, medium and high voltage devices. Improved methods of fabrication for power devices are provided according to other aspects of the invention. Improvements to specific processing steps, such as formation of trenches, formation of dielectric layers inside trenches, formation of mesa structures and processes for reducing substrate thickness, among others, are presented.
Type:
Application
Filed:
May 31, 2006
Publication date:
September 28, 2006
Inventors:
Ashok Challa, Alan Elbanhawy, Thomas Grebs, Nathan Kraft, Dean Probst, Rodney Ridley, Steven Sapp, Qi Wang, Chongman Yun, J. Lee, Peter Wilson, Joseph Yedinak, J. Jung, H. Jang, Babak Sani, Richard Stokes, Gary Dolny, John Mytych, Becky Losee, Adam Selsley, Robert Herrick, James Murphy, Gordon Madson, Bruce Marchant, Christopher Rexer, Christopher Kocon, Debra Woolsey
Publication number: 20050167742
Abstract: Various embodiments for improved power devices as well as their methods of manufacture, packaging and circuitry incorporating the same for use in a wide variety of power electronic applications are disclosed. One aspect of the invention combines a number of charge balancing techniques and other techniques for reducing parasitic capacitance to arrive at different embodiments for power devices with improved voltage performance, higher switching speed, and lower on-resistance. Another aspect of the invention provides improved termination structures for low, medium and high voltage devices. Improved methods of fabrication for power devices are provided according to other aspects of the invention. Improvements to specific processing steps, such as formation of trenches, formation of dielectric layers inside trenches, formation of mesa structures and processes for reducing substrate thickness, among others, are presented.
Type:
Application
Filed:
December 29, 2004
Publication date:
August 4, 2005
Applicant:
Fairchild Semiconductor Corp.
Inventors:
Ashok Challa, Alan Elbanhawy, Thomas Grebs, Nathan Kraft, Dean Probst, Rodney Ridley, Steven Sapp, Qi Wang, Chongman Yun, J.G. Lee, Peter Wilson, Joseph Yedinak, J.Y. Jung, H.C. Jang, Babak Sani, Richard Stokes, Gary Dolny, John Mytych, Becky Losee, Adam Selsley, Robert Herrick, James Murphy, Gordon Madson, Bruce Marchant, Christopher Rexer, Christopher Kocon, Debra Woolsey