Patents by Inventor Dedde Hedzer Wiersma

Dedde Hedzer Wiersma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10871413
    Abstract: A method of manufacturing a pressure sensor is shown, wherein the pressure sensor comprises a port element with a sealing structure and a membrane. Four strain gages will be attached to the membrane. The gages are used in a Wheatstone bridge to sense the fluid pressure. A first finite element action determines a first contour around the membrane central axis with equal compressive strain and a second contour around the membrane central axis with equal tensile strain wherein when fluid pressure is applied to the membrane strain on the first contour is opposite strain on the second contour. A second finite element action determines the four positions of the strain gages on the first and second contour such that the difference between the highest error signal and the lowest error signal at the output of the Wheatstone bridge is minimal under influence of parasitic forces.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: December 22, 2020
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventors: Albert Ferdinand Zwijze, Werner John Peter Kleissen, Frank Hendri Jacobs, Dedde Hedzer Wiersma
  • Publication number: 20170307457
    Abstract: A method of manufacturing a pressure sensor is shown, wherein the pressure sensor comprises a port element with a sealing structure and a membrane. Four strain gages will be attached to the membrane. The gages are used in a Wheatstone bridge to sense the fluid pressure. A first finite element action determines a first contour around the membrane central axis with equal compressive strain and a second contour around the membrane central axis with equal tensile strain wherein when fluid pressure is applied to the membrane strain on the first contour is opposite strain on the second contour. A second finite element action determines the four positions of the strain gages on the first and second contour such that the difference between the highest error signal and the lowest error signal at the output of the Wheatstone bridge is minimal under influence of parasitic forces.
    Type: Application
    Filed: April 5, 2017
    Publication date: October 26, 2017
    Inventors: Albert Ferdinand Zwijze, Werner John Peter Kleissen, Frank Hendri Jacobs, Dedde Hedzer Wiersma
  • Patent number: 9746390
    Abstract: Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that includes the sense element, the port enabling a decoupling feature for sealing and parasitic sealing forces and a reduction of a port length, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: August 29, 2017
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventors: Ernie Johannus Antonius Schoot Uiterkamp, Dedde Hedzer Wiersma, Frank Hendri Jacobs
  • Publication number: 20160252418
    Abstract: Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that includes the sense element, the port enabling a decoupling feature for sealing and parasitic sealing forces and a reduction of a port length, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.
    Type: Application
    Filed: February 26, 2015
    Publication date: September 1, 2016
    Inventors: Ernie Johannus Antonius Schoot Uiterkamp, Dedde Hedzer Wiersma, Frank Hendri Jacobs
  • Patent number: 9312610
    Abstract: In an embodiment, a stepped spring contact may have a first portion, a transition portion, and a second portion. The first portion may include a plurality of windings whose pitch may vary. The second portion may include a plurality of windings that are closely wound. A pitch of the windings contained in the second portion may be, for example, constant. The transition portion may include a winding that may make mechanical and electrical contact with a first electrical conductor (e.g., a pad contained on a printed circuit board (PCB)). The first portion may include a tip. The tip may be, for example, flat shaped or conically shaped. The tip may make electrical contact with a second electrical conductor (e.g., a terminal connector). In operation, the stepped spring contact may provide electrical continuity between the first electrical conductor and the second electrical conductor.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: April 12, 2016
    Assignee: Sensata Technologies, Inc.
    Inventors: Andrew Willner, Giovanni Fraone, Dedde Hedzer Wiersma, Andrew LeGendre, Raymond E. Mandeville, Shuo Robert Chen, Ted Medeiros, Matt Nelson