Abstract: The present disclosure discloses a full adder based on resistive-switching devices and an operation method thereof. A multi-bit full adder circuit is constituted by using a cross-bar array of resistive-switching devices, wherein data of standard sums is stored on the principle diagonal of the cross-bar array in a nonvolatile manner, and carry data is stored in adjacent units on both sides of the principle diagonal. The carry data is stored according to whether the storage loop (crosstalk loop) is turned on. With the present disclosure, the multi-bit full adder circuit is significantly simplified. Thereby, additional circuits for generating a carry signal are reduced, the circuit delay and chip area are decreased, and the adder has an ability of nonvolatile storage.

Abstract: The present disclosure discloses a full adder based on resistive-switching devices and an operation method thereof. A multi-bit full adder circuit is constituted by using a cross-bar array of resistive-switching devices, wherein data of standard sums is stored on the principle diagonal of the cross-bar array in a nonvolatile manner, and carry data is stored in adjacent units on both sides of the principle diagonal. The carry data is stored according to whether the storage loop (crosstalk loop) is turned on. With the present disclosure, the multi-bit full adder circuit is significantly simplified. Thereby, additional circuits for generating a carry signal are reduced, the circuit delay and chip area are decreased, and the adder has an ability of nonvolatile storage.

Abstract: Designs and fabrication of a FinFET are provided. In one implementation, the fabrication can include forming a dielectric stripe on a substrate; implanting ions to the substrate by using the dielectric stripe as a mask so as to convert a surface layer of the substrate to an amorphous layer; forming an amorphous semiconductor layer on the substrate covering the dielectric stripe and recrystallizing each of the amorphous layer and the amorphous semiconductor layer to be a monocrystalline layer; processing regions beside two ends of the dielectric stripe to form a protective layer, the regions being predesigned as source and drain regions; forming recrystallized semiconductor spacers at two sides of the dielectric stripe uncovered by the protective layer, and forming recrystallized semiconductor blocks on regions covered by the protective layer; removing the dielectric stripe between the spacers so that the spacers can be formed as Fin bodies.

Abstract: Disclosed is a method for manufacturing a self-aligned metal oxide thin film transistor. According to the present invention, a metal oxide semiconductor layer having a high carrier concentration is formed, and then a channel region which is self-aligned with a gate electrode is oxidized by a plasma having oxidbillity so that the channel region has a low carrier concentration and the source and drain regions have high carrier concentrations while the resulting transistor has a self-aligned structure. In addition, the threshold voltage of the transistor is controlled by the conditions under which the channel region of the transistor is subsequently oxidized by plasma having oxidbillity at a low temperature. Therefore, the controllability of the characteristics of the transistor is improved significantly, and the manufacturing process is simplified.

Abstract: Designs and fabrication of a FinFET are provided. In one implementation, the fabrication can include forming a dielectric stripe on a substrate; implanting ions to the substrate by using the dielectric stripe as a mask so as to convert a surface layer of the substrate to an amorphous layer; forming an amorphous semiconductor layer on the substrate covering the dielectric stripe and recrystallizing each of the amorphous layer and the amorphous semiconductor layer to be a monocrystalline layer; processing regions beside two ends of the dielectric stripe to form a protective layer, the regions being predesigned as source and drain regions; forming recrystallized semiconductor spacers at two sides of the dielectric stripe uncovered by the protective layer, and forming recrystallized semiconductor blocks on regions covered by the protective layer; removing the dielectric stripe between the spacers so that the spacers can be formed as Fin bodies.

Abstract: Disclosed is a method for manufacturing a self-aligned metal oxide thin film transistor. According to the present invention, a metal oxide semiconductor layer having a high carrier concentration is formed, and then a channel region which is self-aligned with a gate electrode is oxidized by a plasma having oxidbillity so that the channel region has a low carrier concentration and the source and drain regions have high carrier concentrations while the resulting transistor has a self-aligned structure. In addition, the threshold voltage of the transistor is controlled by the conditions under which the channel region of the transistor is subsequently oxidized by plasma having oxidbillity at a low temperature. Therefore, the controllability of the characteristics of the transistor is improved significantly, and the manufacturing process is simplified.

Abstract: Disclosed is a method for manufacturing a metal oxide thin film transistor. According to the method, an active layer having a high carrier concentration is formed, and then a channel region is oxidized by plasma having oxidbillity so that the channel region has a low carrier concentration while a source region and a drain region have high carrier concentrations. In addition, the threshold voltage of the transistor is controlled by the conditions under which the channel region of the transistor is subsequently oxidized by plasma having oxidbillity at a low temperature. Therefore, the controllability of the characteristics of the transistor is improved significantly, and the manufacturing process is simplified.