Patents by Inventor Deenesh Bundi

Deenesh Bundi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Engineered non-polymeric organic particles for chemical mechanical planarization
    Patent number: 7419519
    Abstract: An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
    Type: Grant
    Filed: January 5, 2006
    Date of Patent: September 2, 2008
    Assignee: Dynea Chemicals Oy
    Inventors: Yuzhuo Li, Kwok Tang, Wu Li, Guomin Bian, Krishnayya Cheemalapati, Vivek Duvvuru, Deenesh Bundi, Henry Bian
  • Engineered non-polymeric organic particles for chemical mechanical planarization
    Publication number: 20060261306
    Abstract: An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
    Type: Application
    Filed: January 5, 2006
    Publication date: November 23, 2006
    Applicant: DYNEA CHEMICALS OY
    Inventors: Yuzhuo Li, Kwok Tang, Wu Li, Guomin Bian, Krishnayya Cheemalapati, Vivek Duvvuru, Deenesh Bundi, Henry Bian