Abstract: A system for automatic routing of chemicals includes a plurality of equipment, including a source and a destination, and one or more possible paths between the source and destination. The system further includes a process control unit to communicate with the equipment, a routing control unit to communicate with the process control unit. The routing control unit is provided with control algorithms for finding an optimum path between the source and the destination based at least partially on feedback from the process control unit.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface, curing the second surface while the laminate remains applied, and removing the laminate. Other embodiments may be described and/or claimed.

Abstract: A method comprising receiving a category of metadata from an accounting software system, receiving a plurality of metadata labels associated with the category of metadata from the accounting software, receiving a ROC, receiving an association of one of the plurality of the metadata labels with the ROC, and/or transmitting the ROC and the association of the one of the plurality of the metadata labels with the ROC to the accounting software system. The category of metadata may comprise a card member name, an image of a receipt associated with the ROC, a description, and the like.

Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a base, situating an adhesive layer on the inner foil, such that the inner foil is substantially flush with a periphery of the base, situating an outer conductive foil on the adhesive layer, or covering an interface between the adhesive layer, the inner foil and the outer conductive foil with a protective material.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface, curing the second surface while the laminate remains applied, and removing the laminate. Other embodiments may be described and/or claimed.

Abstract: Electronic assemblies and methods for their manufacture are described, including those related to the formation of an assembly including a carrier and a resin coated copper layer positioned on the carrier. The resin coated copper layer includes a first layer comprising a resin and a second layer comprising copper, with the first layer bonded to the second layer. The first layer of the resin coated copper is positioned between the carrier and the second layer of the resin coated copper. An opening is formed in the second layer of the resin coated copper. A die is positioned in the opening. A plurality of dielectric layers and metal pathways are positioned on the second layer and on the die. Other embodiments are described and claimed.