Patents by Inventor DEEPAK KUMAR AGARWAL

DEEPAK KUMAR AGARWAL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12681800
    Abstract: Aspects of the disclosure are directed to implementation of a freedom from interference (FFI) safety mechanism. In accordance with one aspect, the disclosure includes initiating a fault handling for a first automotive safety integrity level (ASIL) domain based on a main domain hardware error message; sending a traffic isolation request message for the first ASIL domain; sending a traffic block request message for the first ASIL domain; and executing a block operation and a flush operation on the first ASIL domain based on the traffic isolation request message and the traffic block request message to implement freedom from interference (FFI).
    Type: Grant
    Filed: August 8, 2024
    Date of Patent: July 14, 2026
    Assignee: QUALCOMM Incorporated
    Inventors: Sriram Hariharan, Ghanashyam Prabhu, Yuwen Zou, Deepak Kumar Agarwal, Alexis Gabriel Marcel Boutillier, Subbarao Palacharla
  • Publication number: 20260072835
    Abstract: An apparatus includes a central processing unit (CPU) coupled to a system-on-a-chip (SOC) interconnect. The apparatus also includes multiple logic structures coupled to a memory. The apparatus further includes a safety mechanism coupled to and inline with the memory, the logic structures, and the CPU via the SOC interconnect. The safety mechanism comprises a meta cache and is configured to detect errors in one or more of the logic structures and the memory.
    Type: Application
    Filed: September 11, 2024
    Publication date: March 12, 2026
    Inventors: Ghanashyam PRABHU, Alexis Gabriel Marcel BOUTILLIER, Subbarao PALACHARLA, Sriram HARIHARAN, Deepak Kumar AGARWAL, Satyanarayana AVADHANAM, Yuwen ZOU, Amit ANEJA, Hiral NANDU, Kedar BHOLE, Raunaq NANDY MAJUMDAR, Shri PRAKASH
  • Publication number: 20260044409
    Abstract: Aspects of the disclosure are directed to implementation of a freedom from interference (FFI) safety mechanism. In accordance with one aspect, the disclosure includes initiating a fault handling for a first automotive safety integrity level (ASIL) domain based on a main domain hardware error message; sending a traffic isolation request message for the first ASIL domain; sending a traffic block request message for the first ASIL domain; and executing a block operation and a flush operation on the first ASIL domain based on the traffic isolation request message and the traffic block request message to implement freedom from interference (FFI).
    Type: Application
    Filed: August 8, 2024
    Publication date: February 12, 2026
    Inventors: Sriram HARIHARAN, Ghanashyam PRABHU, Yuwen ZOU, Deepak Kumar AGARWAL, Alexis Gabriel Marcel BOUTILLIER, Subbarao PALACHARLA
  • Publication number: 20250355829
    Abstract: A die-to-die serial data link may be dynamically configured to exclude lanes associated with data errors. In a test mode, data may be transmitted from a first die to a second die over lanes of the link. In the second die, data received on the link in the test mode may be compared with an expected data pattern to detect any bit mismatches. When there are no more than a threshold number of mismatched bits, a receive path in the second die may be configured to use all of the lanes. When there are more than the threshold number of mismatched bits, a sub-group of the lanes that are not associated with mismatched bits may be determined, and the receive path in the second die may be configured to use the sub-group of lanes. In the first die, a transmit path may be configured to use the sub-group of lanes.
    Type: Application
    Filed: July 30, 2025
    Publication date: November 20, 2025
    Inventors: Kunal DESAI, Deepak Kumar AGARWAL
  • Patent number: 12393544
    Abstract: A die-to-die serial data link may be dynamically configured to exclude lanes associated with data errors. In a test mode, data may be transmitted from a first die to a second die over lanes of the link. In the second die, data received on the link in the test mode may be compared with an expected data pattern to detect any bit mismatches. When there are no more than a threshold number of mismatched bits, a receive path in the second die may be configured to use all of the lanes. When there are more than the threshold number of mismatched bits, a sub-group of the lanes that are not associated with mismatched bits may be determined, and the receive path in the second die may be configured to use the sub-group of lanes. In the first die, a transmit path may be configured to use the sub-group of lanes.
    Type: Grant
    Filed: April 18, 2023
    Date of Patent: August 19, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Kunal Desai, Deepak Kumar Agarwal
  • Publication number: 20240354275
    Abstract: A die-to-die serial data link may be dynamically configured to exclude lanes associated with data errors. In a test mode, data may be transmitted from a first die to a second die over lanes of the link. In the second die, data received on the link in the test mode may be compared with an expected data pattern to detect any bit mismatches. When there are no more than a threshold number of mismatched bits, a receive path in the second die may be configured to use all of the lanes. When there are more than the threshold number of mismatched bits, a sub-group of the lanes that are not associated with mismatched bits may be determined, and the receive path in the second die may be configured to use the sub-group of lanes. In the first die, a transmit path may be configured to use the sub-group of lanes.
    Type: Application
    Filed: April 18, 2023
    Publication date: October 24, 2024
    Inventors: Kunal DESAI, Deepak Kumar AGARWAL
  • Patent number: 11809220
    Abstract: Error detection and correction (EDAC) logic of a memory subsystem may be monitored for error corrections, with the EDAC logic configured to use a first EDAC level. The number of error corrections made by the EDAC logic while using the first EDAC level during a time interval may be determined. The EDAC logic may be switched from using the first EDAC level to using a second EDAC level when the number of error corrections using the first EDAC level during the time interval exceeds a threshold.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: November 7, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Deepak Kumar Agarwal, Kunal Desai, Jimit Shah, Rakesh Gehalot
  • Publication number: 20230342241
    Abstract: Error detection and correction (EDAC) logic of a memory subsystem may be monitored for error corrections, with the EDAC logic configured to use a first EDAC level. The number of error corrections made by the EDAC logic while using the first EDAC level during a time interval may be determined. The EDAC logic may be switched from using the first EDAC level to using a second EDAC level when the number of error corrections using the first EDAC level during the time interval exceeds a threshold.
    Type: Application
    Filed: April 20, 2022
    Publication date: October 26, 2023
    Inventors: DEEPAK KUMAR AGARWAL, Kunal DESAI, Jimit SHAH, Rakesh GEHALOT