Abstract: A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.

Abstract: A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.

Abstract: A surface mount device chip fuse including a dielectric substrate, electrically conductive first and second upper terminals disposed on a top surface of the dielectric substrate and defining a gap therebetween, a fusible element formed of solder disposed on the top surface of the dielectric substrate, within the gap, bridging the first and second upper terminals, and electrically conductive first and second lower terminals disposed on a bottom surface of the dielectric substrate and electrically connected to the first and second upper terminals, respectively, wherein a material of the dielectric substrate exhibits a de-wetting characteristic relative to the solder from which the fusible element is formed.

Abstract: A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.

Abstract: Structurally supported electrical transient materials are disclosed. Furthermore, methods to provide structurally supported electrical transient materials are disclosed. In one implementation, a structurally supported electrical transient material includes a support structure that is at least partially covered by an electrical transient material. In one example, the support structure is a mesh material integrated at least partially in the electrical transient material.

Abstract: A circuit protection device in which a PTC element made from a PTC composition includes or has at a boundary thereof a mechanical stress riser. The device will be tripped by, and provide reversible protection against, a first set of fault conditions, and will also provide protection at least one time against a second, more severe, set of fault conditions which cause physical disruption of the device and which cause the device to have a substantially infinite resistance. Devices of the invention are useful in protecting against relatively high voltages.