Patents by Inventor Deepak Saagar Kalaikadal
Deepak Saagar Kalaikadal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250006519Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.Type: ApplicationFiled: June 28, 2023Publication date: January 2, 2025Applicant: Applied Materials, Inc.Inventors: Kyle M. Hanson, Eric J. Bergman, Gregory J. Wilson, Paul R. McHugh, Benjamin Clay Bradley, Aaron Paul Juntunen, Deepak Saagar Kalaikadal, Daniel Durado, Carl Campbell Stringer, James Jay Tripp, Jason A. Rye, John L. Klocke
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Patent number: 11982008Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.Type: GrantFiled: January 24, 2023Date of Patent: May 14, 2024Assignee: APPLIED Materials, Inc.Inventors: Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R. Borjesson
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Patent number: 11697887Abstract: Electroplating systems may include an electroplating chamber. The systems may also include a replenish assembly fluidly coupled with the electroplating chamber. The replenish assembly may include a first compartment housing anode material. The first compartment may include a first compartment section in which the anode material is housed and a second compartment section separated from the first compartment section by a divider. The replenish assembly may include a second compartment fluidly coupled with the electroplating chamber and electrically coupled with the first compartment. The replenish assembly may also include a third compartment electrically coupled with the second compartment, the third compartment including an inert cathode.Type: GrantFiled: October 23, 2020Date of Patent: July 11, 2023Assignee: Applied Materials, Inc.Inventors: Nolan L. Zimmerman, Charles Sharbono, Gregory J. Wilson, Paul R. McHugh, Paul Van Valkenburg, Deepak Saagar Kalaikadal, Kyle M. Hanson
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Publication number: 20230167573Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.Type: ApplicationFiled: January 24, 2023Publication date: June 1, 2023Inventors: Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R. Borjesson
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Patent number: 11578422Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.Type: GrantFiled: January 24, 2022Date of Patent: February 14, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R. Borjesson
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Publication number: 20220145489Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.Type: ApplicationFiled: January 24, 2022Publication date: May 12, 2022Inventors: Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R. Borjesson
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Publication number: 20220127747Abstract: Electroplating systems may include an electroplating chamber. The systems may also include a replenish assembly fluidly coupled with the electroplating chamber. The replenish assembly may include a first compartment housing anode material. The first compartment may include a first compartment section in which the anode material is housed and a second compartment section separated from the first compartment section by a divider. The replenish assembly may include a second compartment fluidly coupled with the electroplating chamber and electrically coupled with the first compartment. The replenish assembly may also include a third compartment electrically coupled with the second compartment, the third compartment including an inert cathode.Type: ApplicationFiled: October 23, 2020Publication date: April 28, 2022Applicant: Applied Materials, Inc.Inventors: Nolan L. Zimmerman, Charles Sharbono, Gregory J. Wilson, Paul R. McHugh, Paul Van Valkenburg, Deepak Saagar Kalaikadal, Kyle M. Hanson
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Patent number: 11268208Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.Type: GrantFiled: May 8, 2020Date of Patent: March 8, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Paul R McHugh, Gregory J Wilson, Kyle M Hanson, John L Klocke, Paul Van Valkenburg, Eric J Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R Borjesson
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Publication number: 20210348296Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.Type: ApplicationFiled: May 8, 2020Publication date: November 11, 2021Inventors: Paul R McHugh, Gregory J Wilson, Kyle M Hanson, John L Klocke, Paul Van Valkenburg, Eric J Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R Borjesson